Experience

Andrews Cooper

• United States
• Engineering Services
• 100 - 200 Employee

• Senior Mechanical Engineer

  • Mar 2010 - Present



Hewlett Packard Enterprise

• United States
• IT Services and IT Consulting
• 700 & Above Employee

• Electrical/Hardware Engineer V

  • 2003 - 2009

  Developed numerous fixtures and tools to enable die to wafer attach and wafer to wafer bonding (vacuum roller laminator, wafer chucks, die trays, alignment masks, particle cleaning fixtures, etc.).Developed concepts for high efficiency solar cell manufacturability (patent pending).Developed two proof of concept models for new optical disk drive (2 patents pending).U.S. Patent 7867548 "Thermal Ejection of Solution Having Solute Onto Device Medium"U.S. Patent 7890968 "Optical Disc Device Having Two Optomechanical Mechanisms"U.S. Patent 7933191 "Optical Disc Drive Having Two Optomechanical Mechanisms"

• Hardware Design Engineer

  • 2001 - 2003

• Manufacturing Development Engineer

  • 1994 - 2001



Owens Design

• United States
• Automation Machinery Manufacturing
• 1 - 100 Employee

• Engineer

  • 1985 - 1994

  Designed and programmed multiple stations (rotary dial table, pouch stuffer, linear thermal cure) for Biotrack medical diagnostic device. Developed multiple web processing tools (coaters, laminators, inspection table) for Lifescan home blood glucose monitor. Wrote PLC code for Komag disc drive tool. Developed high speed ballot counter feed mechanism. Designed paper transport for Xerox ink jet printer. Designed shock and vibration mounts for Apple Computer Macintosh burn-in line.



Dataproducts

• Engineer

  • 1984 - 1985

  Reduced overheating of dot matrix printer by performing thermal analysis, designing power supply heatsinks, and specifying fan.Tested and revised papaer feeder design for improved performance at temperature and humidity extremes.