Experience

xMEMS

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Co-founder, VP of NPI

  • Apr 2018 - Present

  - Lead the NPI (new products introduction) team - Design wafer processes for company's new products and built prototypes in a university fab - Manage wafer foundry to bring products to mass production - Develop automated wafer level and final test equipment - Develop packaging process - Set up yield analysis capability and analyze test data for yield improvement - Lead the NPI (new products introduction) team - Design wafer processes for company's new products and built prototypes in a university fab - Manage wafer foundry to bring products to mass production - Develop automated wafer level and final test equipment - Develop packaging process - Set up yield analysis capability and analyze test data for yield improvement



Kolo Medical

• Medical Equipment Manufacturing
• 1 - 100 Employee

• Director of MEMS Products

  • Jul 2013 - Mar 2018

  - Assessed company’s technology and business strategy and then evaluated multiple supply chain candidates to find the matching partners. - Built a supply chain consisted of a key starting material supplier, a wafer foundry, and a package house for MEMS ultrasound transducer modules. Managed this supply chain from initial engagements to production. - Customized supplier agreements and negotiated wafer and package prices with supplier chain vendors. - Worked with a package house to develop a high-density interconnect using a flexible PC board and flip chip bonding. - Developed wafer processes for company’s 3-D ultrasound transducer using wafer-to-wafer bonding and TSV and then transferred it into a foundry. Show less



Fujifilm Dimatix

• United States
• Nanotechnology Research
• 200 - 300 Employee

• Principal Engineer

  • Nov 2010 - Jul 2013

  - Managed a project to develop a packaging technology for company’s next generation inkjet print head with sputtered PZT using on-chip high-density interconnect and wafer to wafer bonding. - Developed a wafer level eutectic bonding technology with TSV for an ultrasound device. - Improved package yields in production by analyzing package defects and then proposed solutions to minimize these defects. - Managed a project to develop a packaging technology for company’s next generation inkjet print head with sputtered PZT using on-chip high-density interconnect and wafer to wafer bonding. - Developed a wafer level eutectic bonding technology with TSV for an ultrasound device. - Improved package yields in production by analyzing package defects and then proposed solutions to minimize these defects.



Mcube Inc, Taiwan

• Senior Manager of Integration Engineering

  • 2009 - 2010

  - Worked hands-on with a MEMS foundry and a package house to deliver company’s first 3-axis accelerometer samples for customer evaluation. - Identified, evaluated, and then helped to select package and test partners. Managed these partners from initial contacts to successful samples delivery. - Worked hands-on with a MEMS foundry and a package house to deliver company’s first 3-axis accelerometer samples for customer evaluation. - Identified, evaluated, and then helped to select package and test partners. Managed these partners from initial contacts to successful samples delivery.



InvenSense, Taiwan

• Director of MEMS Operations

  • 2007 - 2009

  - Set up company’s Taiwan operation and helped to bring it into the Hsinchu Science Park. Wrote a business plan in Chinese for the Hsinchu Science Park application, handled all financial and legal matters in the first 7 months of operation, set up a cleanroom for wafer and product tests, and grew Taiwan operation into a 10-person team. - Managed and helped company’s first Taiwan MEMS foundry to successfully ramp a 2-axis gyroscope from zero to 1M units per month. Brought a 3-axis gyroscope on 8-inch wafer into risk production at a second Taiwan MEMS foundry. - Improved wafer level yields from <20% to >80% by working closely with a wafer foundry. - Drafted a supplier agreement and negotiated terms with a MEMS foundry. Show less



APM

• Technology, Information and Internet

• VP of Marketing & Sales

  • 2006 - 2007

  - Set the marketing strategy for the third largest MEMS foundry in the world at that time by leveraging the strategic alliance with the UMC Group and aggressively going after promising MEMS startups. - Brought in a tier-one automotive customer with an estimated revenue of US$3M/year for the next 10 years. Negotiated supplier contracts with and set the die pricing for this customer. - Negotiated successfully a price increase from a customer which resulted in additional US$1M/year revenue for the company. Show less



Lightconnect Inc.

• United States
• Biotechnology

• Sr. MEMS Engineer

  • 2002 - 2005

  - Delivered the world’s best-selling MEMS VOA devices from concept to working prototype in six weeks in a 2-person team. This product accounted for more than $15 million and >50% of company’s accumulative revenue from 2002 to 2006. - Designed and brought to production in a wafer foundry a second VOA based on a different design. - Delivered the world’s best-selling MEMS VOA devices from concept to working prototype in six weeks in a 2-person team. This product accounted for more than $15 million and >50% of company’s accumulative revenue from 2002 to 2006. - Designed and brought to production in a wafer foundry a second VOA based on a different design.



AIP Networks

• Appliances, Electrical, and Electronics Manufacturing

• Technical Staff

  • 2000 - 2001

  - Developed a wafer process flow and built company’s first MEMS micro-mirror devices in a university fab under a tight time and resource constraint. The delivered devices result in a working 1x4 optical switch demo. - Developed a wafer process flow and built company’s first MEMS micro-mirror devices in a university fab under a tight time and resource constraint. The delivered devices result in a working 1x4 optical switch demo.



United MicroMachining Corp

• Technical Staff

  • 1997 - 2000

  - Collaborated with a customer and a CMOS foundry to develop a CMOS-integrated inkjet print head array for a commercial-grade printer. Delivered samples for customer to successfully integrate into its printer. - Collaborated with a customer and a CMOS foundry to develop a CMOS-integrated inkjet print head array for a commercial-grade printer. Delivered samples for customer to successfully integrate into its printer.



EG&G IC Sensors

• Sr. Process Engineer

  • 1995 - 1997

  - Developed process technology and improved yields for a piezoresistive MEMS accelerometer for automotive airbag application. Supervised two technicians. - Developed process technology and improved yields for a piezoresistive MEMS accelerometer for automotive airbag application. Supervised two technicians.