Daniele Marchisotti
System Integration Engineer at Aresys- Claim this Profile
Click to upgrade to our gold package
for the full feature experience.
Topline Score
Bio
Experience
-
Aresys
-
Italy
-
Telecommunications
-
1 - 100 Employee
-
System Integration Engineer
-
Feb 2023 - Present
-
-
-
Politecnico di Milano
-
Italy
-
Research Services
-
700 & Above Employee
-
-
Nov 2019 - Jan 2023
Thesis: "3D-based vision measurements in dynamic environments: scanning from drones"The main objective of my research is to measure defects in concrete structures with 3Dreconstruction performed by drones. 3D maps are obtained through SLAM and 3D reconstruction algorithms, from data acquired mainly from Time-of-Flight sensors
-
-
-
Mar 2019 - Oct 2019
The main activities were focused on the analysis of data acquired during tests and on thecreation of measurement setup. Main activities: 1) Wind tunnel tests to measure the displacement and vibrations of a large deformation tensile structure. The 3D geometry was obtained through 3 ToF sensors at different wind velocities and by extracting different sections of the object;2) Development of a LabVIEW software for different kinds of analysis and measurement acquisitions. For example, pressure measurements with Prescale Fuji Films and 3D reconstruction of sails geometry with machine vision;3) Analysis of bounding box position uncertainty of object detection neural networks in Halcon software Show less
-
-
-
Hyster-Yale Group
-
United States
-
Machinery Manufacturing
-
700 & Above Employee
-
Test Engineer
-
Mar 2018 - Mar 2019
Planning, scheduling and implementation of tests of products, according to international standards and internal companies procedures, with main objective of assessing feasibility and reliability of prototypes and new products. Writing of related technical reports. Planning, scheduling and implementation of tests of products, according to international standards and internal companies procedures, with main objective of assessing feasibility and reliability of prototypes and new products. Writing of related technical reports.
-
-
-
Private Doctor
-
Bergamo Area, Italy
-
Intership for Software Development
-
Jan 2018 - Mar 2018
Further development of the software for hand dimensions measurement of the Master thesis, through Intel RealSense D435 and D415 sensors Further development of the software for hand dimensions measurement of the Master thesis, through Intel RealSense D435 and D415 sensors
-
-
Education
-
Politecnico di Milano
Master of Science - MS, Mechanical Engineering - Mechatronics and Robotics -
Chalmers tekniska högskola
Erasmus+ Exchange Programme, Systems, Control & Mechatronics -
Università degli Studi di Pavia
Bachelor of Science - BS, Ingegneria industriale