Cristopher Arcega
PCCT Assembly Engineer at Redlen Technologies Inc.- Claim this Profile
Click to upgrade to our gold package
for the full feature experience.
Topline Score
Bio
Edward Fontanilla
Cris is a top notch engineer. Very technical guy in wirebond process. I worked with Cris in Statschippac and he handle the wirebond process characterization, LVM to HVM mode with smooth and flawless execution. Very knowledgeable on statistical analysis, hands on engineer, and technically capable to handle any process characterization through design experiments. Really commendable!!!
Edward Fontanilla
Cris is a top notch engineer. Very technical guy in wirebond process. I worked with Cris in Statschippac and he handle the wirebond process characterization, LVM to HVM mode with smooth and flawless execution. Very knowledgeable on statistical analysis, hands on engineer, and technically capable to handle any process characterization through design experiments. Really commendable!!!
Edward Fontanilla
Cris is a top notch engineer. Very technical guy in wirebond process. I worked with Cris in Statschippac and he handle the wirebond process characterization, LVM to HVM mode with smooth and flawless execution. Very knowledgeable on statistical analysis, hands on engineer, and technically capable to handle any process characterization through design experiments. Really commendable!!!
Edward Fontanilla
Cris is a top notch engineer. Very technical guy in wirebond process. I worked with Cris in Statschippac and he handle the wirebond process characterization, LVM to HVM mode with smooth and flawless execution. Very knowledgeable on statistical analysis, hands on engineer, and technically capable to handle any process characterization through design experiments. Really commendable!!!
Experience
-
Redlen Technologies Inc.
-
Canada
-
Semiconductor Manufacturing
-
100 - 200 Employee
-
PCCT Assembly Engineer
-
Jun 2020 - Present
-
-
-
Infineon Technologies
-
Germany
-
Semiconductor Manufacturing
-
700 & Above Employee
-
Staff Engineer
-
Jan 2012 - Jun 2020
New Product Integration Product Test Engineering December 2015 - present Staff Process Engineer Ball and Wedge Bond Process Development and Equipment Systematic January - December 2015 Senior Process Engineer Package Technology and Innovation January 2012 - January 2015 New Product Integration Product Test Engineering December 2015 - present Staff Process Engineer Ball and Wedge Bond Process Development and Equipment Systematic January - December 2015 Senior Process Engineer Package Technology and Innovation January 2012 - January 2015
-
-
-
-
Process Engineer
-
Jan 2006 - Jan 2012
New Package Introduction/Qualification Process Development and Manufacturing, Wirebond New Package Introduction/Qualification Process Development and Manufacturing, Wirebond
-
-
-
Amkor Technology, Inc.
-
United States
-
Semiconductor Manufacturing
-
700 & Above Employee
-
Process Engineer
-
Feb 1997 - Jan 2006
New Package Introduction/Qualification Process Development, Wirebond System in Package Department 2003-2006 Process Engineering, Wirebond Super Ball Grid Array (SBGA) Department 1999-2003 Maintenance Equipment Eng'g, FOL Plastic Ball Grid Array (PBGA) 1997-1999 New Package Introduction/Qualification Process Development, Wirebond System in Package Department 2003-2006 Process Engineering, Wirebond Super Ball Grid Array (SBGA) Department 1999-2003 Maintenance Equipment Eng'g, FOL Plastic Ball Grid Array (PBGA) 1997-1999
-
-
Education
-
2000 - 2004
Technological University of the Philippines
Bachelor of Science, Electronics and Communication Engineering -
1992 - 1995
MFI Polytechnic Institute Inc.
Diploma, Instrumentation and Process Control Technology
Community
