Colin Scott

Lead Hardware Engineer at Calnex Solutions Ltd.
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Location
Falkirk, Scotland, United Kingdom, UK

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Experience

    • United Kingdom
    • Freight and Package Transportation
    • Lead Hardware Engineer
      • Jan 2011 - Present

      • Overall technical responsibility for the design of existing and new hardware products at Calnex. • Lead the hardware team during the development and integration of Calnex products. • Define the main architecture blocks and different boards to be designed for products. • Design schematics via OrCAD and Mentor CAD tools. • Work with external PCB sub-contractors during the design of printed circuit boards. • Work with the Project Manager to track the progress of the product development against the project plan • Work with the Mechanical Engineer to ensure the successful integration of new hardware into Calnex custom instrument mainframes. • Debugging and solving issues during the initial turn-on and system integration of products. • Responsible for all VHDL design aspects from writing code and test benches, functional simulation via ModelSIM, building and successfully integrating designs into Xilinx FPGA technology Show less

    • United Kingdom
    • Business Consulting and Services
    • Senior Hardware Engineer
      • 2006 - 2011

      • Responsible for all electronic hardware design aspects of Nallatech’s products for the military and aerospace markets. • Design schematics via Mentor CAD tools • Component placement and routing of multi-layer, high density interconnect, controlled PCBs. • Design custom heat-frames to enable products to operate in both air cooled and conduction cooled systems. • Designed systems used to test Nallatech’s products in a low volume and complex manufacturing process • Responsible for all electronic hardware design aspects of Nallatech’s products for the military and aerospace markets. • Design schematics via Mentor CAD tools • Component placement and routing of multi-layer, high density interconnect, controlled PCBs. • Design custom heat-frames to enable products to operate in both air cooled and conduction cooled systems. • Designed systems used to test Nallatech’s products in a low volume and complex manufacturing process

    • Baseband Team Leader
      • 2005 - 2006

      Responsible for a diverse team of engineers covering processor, audio and power design disciplines. This team was responsible for defining the architecture for Motorola’s next generation of 3G mobile phone products, and delivering a platform that was used by other engineering teams to develop 3G mobile phone products. Responsible for a diverse team of engineers covering processor, audio and power design disciplines. This team was responsible for defining the architecture for Motorola’s next generation of 3G mobile phone products, and delivering a platform that was used by other engineering teams to develop 3G mobile phone products.

    • IT Services and IT Consulting
    • Senior Baseband Engineer
      • 2003 - 2005

      • Designed the baseband electronic circuits utilised within Sendo’s GSM/GPRS mobile phone products. Primarily focussed on designing products for low power consumption. • Responsible for all high-speed digital design activities within the baseband team. • Accountable for the component bill of materials for products, in order to increase the profitability margin of Sendo. • Resolved issues to ensure that designs could be successfully produced in a high volume manufacturing environment. • Designed the baseband electronic circuits utilised within Sendo’s GSM/GPRS mobile phone products. Primarily focussed on designing products for low power consumption. • Responsible for all high-speed digital design activities within the baseband team. • Accountable for the component bill of materials for products, in order to increase the profitability margin of Sendo. • Resolved issues to ensure that designs could be successfully produced in a high volume manufacturing environment.

    • Biotechnology Research
    • 700 & Above Employee
    • Senior Hardware Engineer
      • 2000 - 2003

      • Responsible for the design of electronic hardware boards used in Agilent Technologies products. • High speed digital design and simulation • Created the design rules to enable PCB engineers to successfully design printed circuit boards. • Integration of hardware with firmware, software and other hardware boards used to collectively create the functionality for Agilent Technologies products. • Supported manufacturing engineers through ‘New Product Introduction’, qualification, and mature production of Agilent Technologies products. Show less

    • United States
    • Individual and Family Services
    • Hardware Engineer
      • 1998 - 2000

      Designed the electronic circuitry and printed circuit board for the USB docking station for an MP3 player. Also wrote the assembly code for the 8051 microprocessor in the USB docking station. This code enabled the successful transfer of data between a PC and the MP3 player, via the USB interface. Designed the electronic circuitry and printed circuit board for the USB docking station for an MP3 player. Also wrote the assembly code for the 8051 microprocessor in the USB docking station. This code enabled the successful transfer of data between a PC and the MP3 player, via the USB interface.

Education

  • Napier University
    BEng (Honours), Electronics and Communications Engineering
    1995 - 1999
  • Denny High School

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