Experience

GoerTek Inc.

• China
• Computers and Electronics Manufacturing
• 500 - 600 Employee

• Sr. Optical Process Engineer

  • Apr 2020 - Present



Ostendo Technologies

• United States
• Computers and Electronics Manufacturing
• 1 - 100 Employee

• Sr. Process engineer

  • Jun 2015 - Apr 2020

  Job Description & Responsibilities: 1. Wafer-level micro-lens array process development and fabrication. 2. Developing the Augmented Reality (AR) optics. 3. Develop NanoImprinting Lithography (NIL) process for Light Field Display (LFD). 4. Ultra-precision machining operation. Major Achievements: 1. Accomplish advanced AR optics prototyping process development. Including optics precision machining, surface quality verification, optics assembly, and image testing. 2. Developed the process and characterize the optical performance of the wafer-level micro-lens array (MLA). 3. Build up Laser Profiler metrology system from survey through evaluation, tool installation, qualification, documentation, tool operation training and certification. Show less



OMNIVISION

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Sr. Engineer

  • Jul 2011 - Jun 2015

  Job Description & Responsibilities: 1. Develop Wafer-Level Optics (WLO) process. 2. Die bonding process evaluation 3. New technology development and transfer to mass-production 4. Reliability test flow and failure analysis 5. New materials evaluation Major Achievements: 1. Establish test, qualify and release different adhesive/process for WLO bonding in different structures. 2. Improve 50% bonding accuracy by dry-film. 3. Save 80% costs on spacer material implement. 4. Solve the light leaking problem of 2X2 lens module to get higher pixel size image. 5. Developed the Ultra-thin glass substrate (100um) WLO bonding process for high-end lens module. Show less



VisEra Technologies, Inc.

• Hsinchu County/City, Taiwan

• Sr. Engineer

  • Oct 2009 - Jun 2011

  Job Description & Responsibilities: 1. Wafer-level bonding – dispensing recipe set up and parameter verification 2. Wafer-level bonding – bonding accuracy evaluate 3. Evaluate, verify and qualify bonding adhesive 4. New materials evaluation Major Achievements: 1. Improve wafer bonding accuracy improvement of 50%. 2. Survey, test and qualify wafer bonding adhesive. 3. Conduct Dry-film bonding materials evaluation and releasing. Job Description & Responsibilities: 1. Wafer-level bonding – dispensing recipe set up and parameter verification 2. Wafer-level bonding – bonding accuracy evaluate 3. Evaluate, verify and qualify bonding adhesive 4. New materials evaluation Major Achievements: 1. Improve wafer bonding accuracy improvement of 50%. 2. Survey, test and qualify wafer bonding adhesive. 3. Conduct Dry-film bonding materials evaluation and releasing.



Tripod Technology Corp.

• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Engineer

  • Oct 2007 - Oct 2008

  Job Description & Responsibilities: 1. Advanced Printed Circuit Board technology development 2. Process issue solving and yield rate improvement Major Achievements: 1. Improve the gold finger yield rate from 30% to 95% 2. Blind drill process survey and development for high-end PCB design. 3. Text ink-jetting machine evaluation. Job Description & Responsibilities: 1. Advanced Printed Circuit Board technology development 2. Process issue solving and yield rate improvement Major Achievements: 1. Improve the gold finger yield rate from 30% to 95% 2. Blind drill process survey and development for high-end PCB design. 3. Text ink-jetting machine evaluation.