Experience

Ayar Labs

• United States
• Computer Hardware Manufacturing
• 1 - 100 Employee

• Senior Principal Engineer

  • 2020 - Present



Rambus

• United States
• Semiconductors
• 500 - 600 Employee

• Engineering Director

  • 2018 - 2019

  IP Cores DivisionSignal Integrity Test and Analysis Lead on PAM-4 CEI-56G/112G-LR (400GAUI-8-LR/400GBASE-KR4) SERDES products.

• Technical Director

  • 2016 - 2018

  Rambus LabsSERDES Tx/Rx AFE design and test for Cryogenic-memory front-side bus. Transferred AFE design and socket concept to customer for interface to superconducting processor. Signal Integrity and Power Integrity Lead on memory-controller testchip.

• Senior Principal Engineer

  • 2008 - 2016

  Memory and Interfaces DivisionSignal Integrity Test Lead for Terabit Bandwidth Initiative (16-20Gb/s/pin memory PHY) and Rambus Mobile Memory Initiative (stacked die, 4x faster than LPDDR2 and 3 years before LPDDR3). Timing-jitter and proprietary-memory-system voltage-timing budgeting expert. Signal Integrity Lead on 10GBASE-KR / PCIe3 SERDES product, 100GBASE-KR4 / CEI-28G-MR product, PCIe4 product, and a 40Gb/s SERDES demonstrator. Power Integrity validation.

• Principal Engineer

  • 2004 - 2008

  Memory and Interfaces DivisionSignal Integrity Test Lead for PlayStation3 project at Rambus. Characterization and Model Correlation on XDR Memory Subsystem, FlexIO CPU-GPU bus, and Southbridge. SI test and analysis of cost-reduction solutions.

• Senior Member Of Technical Staff

  • 2003 - 2004

  Memory and Interfaces DivisionSignal Integrity test and analysis for NPI of XDR memory PHY.



Ignis Optics Inc

• Consulting Member of Technical Staff

  • 2002 - 2002

  Fiber-Optics R&DPerformance improvement and cost reduction on a 10Gb/s single-mode-fiber receiver. Fiber-Optics R&DPerformance improvement and cost reduction on a 10Gb/s single-mode-fiber receiver.



Finisar Corporation

• Telecommunications
• 700 & Above Employee

• Senior Development Engineer

  • 2001 - 2002

  Optics DivisionLed 10Gb/s optical-receiver development for both PIN and APD-based products. Optics DivisionLed 10Gb/s optical-receiver development for both PIN and APD-based products.



Tripath Technology

• Semiconductors
• 1 - 100 Employee

• Principal Engineer/Scientist

  • 2000 - 2001

  Fiber-Optics R&DModelling of 10Gb/s fiber-optic links in Matlab and LinkSim. Characterized ICs and optical devices. Managed the test lab. Fiber-Optics R&DModelling of 10Gb/s fiber-optic links in Matlab and LinkSim. Characterized ICs and optical devices. Managed the test lab.



HP

• United States
• IT Services and IT Consulting
• 700 & Above Employee

• Engineer/Scientist

  • 1998 - 2000

  Product R&D, Fiber-Optic Communications DivisionGigabit Ethernet transceiver and OC-48 Parallel-optics module design and test.

• Member of Technical Staff

  • 1990 - 1998

  HP Laboratories Division, Solid-State Technology Labmm-wave amplifier, mm-wave dynamic divider, and 50GHz optical receiver design and test. 5GHz and 60GHz ISM-band wireless LAN circuit design and test.