Chong Gim Gan
Principal Engineer, R&D at Altera- Claim this Profile
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Bio
Experience
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Altera
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United States
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Semiconductors
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700 & Above Employee
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Principal Engineer, R&D
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2011 - Present
Technical lead for Altera 28nm, 20nm/16nm, 14nm, 10nm ASIC designs – from semiconductor technology process definition, PPA evaluation, std-cell and PVT definition to RTL2GDS, STA signoff methodology and design tape-out audit. Technical lead for Altera 28nm, 20nm/16nm, 14nm, 10nm ASIC designs – from semiconductor technology process definition, PPA evaluation, std-cell and PVT definition to RTL2GDS, STA signoff methodology and design tape-out audit.
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Intel Corporation
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Senior Design Engineer
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2008 - 2011
Lead backend P&R (place and route) design team in low power, multi-well design, ESD, power grid and metal programmable design flows and methodologies. Successfully tape-out 45nm and 32nm SoC with silicon proven record. Experienced in both cell level and transistor level STA (static timing analysis). Lead backend P&R (place and route) design team in low power, multi-well design, ESD, power grid and metal programmable design flows and methodologies. Successfully tape-out 45nm and 32nm SoC with silicon proven record. Experienced in both cell level and transistor level STA (static timing analysis).
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TSMC
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Taiwan
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Semiconductor Manufacturing
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700 & Above Employee
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Senior Design Engineer
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2004 - 2008
Design, develop and characterize TSMC standard-cell library. Transistor level circuit design optimizations (through new design architecture and silicon process advantages), including energy efficient architecture, power and/or performance tradeoff analysis. Apply ASIC design flow to tape-out VDSM (very deep sub-micron) test chip for circuit behavior verification on silicon. Experienced with cell base design, spice/circuit design, CMOS silicon process (from 0.35um to 28nm to FinFET), device physics and VDSM parasitic effects. Show less
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Intel Corporation
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Component Design Engineer
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2000 - 2004
Write regression tests extensively to simulate, validate and debug VHDL/Verilog RTL model’s logic behavior. Co-work with RTL designer for RTL bugs identification and fixing. Familiar with VHDL/Verilog language and coding. Experienced in Intel C-Sim, assembly language and IA32, IA64, multi-threading architecture. Write regression tests extensively to simulate, validate and debug VHDL/Verilog RTL model’s logic behavior. Co-work with RTL designer for RTL bugs identification and fixing. Familiar with VHDL/Verilog language and coding. Experienced in Intel C-Sim, assembly language and IA32, IA64, multi-threading architecture.
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Education
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Universiti Teknologi Malaysia
Master's Degree, Electrical and Electronics Engineering -
University Sains Malaysia
Bachelor's Degree, Electrical and Electronics Engineering