CHO Yongdae

Quality Manager at Absolics Inc.
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Contact Information
us****@****om
(386) 825-5501
Location
Covington, Georgia, United States, GE
Skills

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Credentials

  • AUTO CAD, CATIA
    -

Experience

  • Absolics Inc.
    • United States
    • Semiconductor Manufacturing
    • 1 - 100 Employee
    • Quality Manager
      • Mar 2022 - Present

      Quality Control Manager Process PPAP Quality Eng’r Resp APQP proc. FMEA/DFMEA of glass base PCB failure mode/cause analysis ISIR of initial production Install CTQ pilot line and production line Setup product qualification plan and testing plan including reliability test. Quality Control Manager Process PPAP Quality Eng’r Resp APQP proc. FMEA/DFMEA of glass base PCB failure mode/cause analysis ISIR of initial production Install CTQ pilot line and production line Setup product qualification plan and testing plan including reliability test.

  • ASEKorea
    • Semiconductor Manufacturing
    • 1 - 100 Employee
    • Product Analyst & Reliability
      • Jun 2020 - Mar 2022

      Product analysis and reliability test Responsible for IC failure analysis and performing reliability test. RF SIP, Flip chip, Automotive sensor, Memory IC. Setup qualification test. Product analysis and reliability test Responsible for IC failure analysis and performing reliability test. RF SIP, Flip chip, Automotive sensor, Memory IC. Setup qualification test.

  • Universal Scientific Industrial Co., Ltd.
    • Taiwan
    • Appliances, Electrical, and Electronics Manufacturing
    • 700 & Above Employee
    • Korea Resident Quality Engineer
      • Aug 2015 - Jun 2020

      General manager of Korea branch. Automotive PCBa assembly for ADAS application. Product Quality control for in-process/Customer/Supplier including IC part. Supplier audit/PPAP/ISIR for PCB, WLCSP, Bumping, sub material. Hyundai-Kia SQ mark certification Board level assembly qualification and reliability plan. Project management of automotive PCBA General manager of Korea branch. Automotive PCBa assembly for ADAS application. Product Quality control for in-process/Customer/Supplier including IC part. Supplier audit/PPAP/ISIR for PCB, WLCSP, Bumping, sub material. Hyundai-Kia SQ mark certification Board level assembly qualification and reliability plan. Project management of automotive PCBA

  • ASE Global
    • Taiwan
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Staff Engineer
      • Sep 2006 - Jul 2015

      R&D Engineer/NPI Quality Engineer Wireless connectiviety module develep, EMI Shield(Plating,Sputtering) develop. Process Eng'r:SMT/ Board level SMT process/FC die bond/Wire bond/Dicing saw. Experience Project management of new IC product. : SIP Module package, WLCSP, BGA, QFN, Sensor, MEMS, Memory Quality Eng'r : NPI project/process qualification, APQP/PPAP management, 8D problem solving, CIP activity & verification for production launcing. Supplier audit(Bumping,Substrate)/Customer audit/Internal process audit. Show less

  • JCET Group
    • China
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Process Engineer
      • May 2004 - Sep 2006

      R&D Engineer Memory card, SiP Module, FC-Hybrid BGA, Thermal enhanced BGA develop. Dicing saw/SMT/DB/Flipchip/WB/Underfill process Engineer. Failure analysis, Material selection, Reliability test, Process DOE/CZ. R&D Engineer Memory card, SiP Module, FC-Hybrid BGA, Thermal enhanced BGA develop. Dicing saw/SMT/DB/Flipchip/WB/Underfill process Engineer. Failure analysis, Material selection, Reliability test, Process DOE/CZ.

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