Experience

Ayar Labs

• United States
• Computer Hardware Manufacturing
• 1 - 100 Employee

• Senior Staff Packaging Engineer

  • Feb 2022 - Present

  -- Optical module package design: Substrate design, mechanical housing design and GD&T using CAD (SolidWorks) -- Optical module assembly flow design: Die bond, wire bond, SMT, 6-DOF active alignment process, UV curing epoxy material selection, UV cure recipe development, adhesive bonding of optical components -- Optomechanical design: Alignment tolerance analysis when optical train is subject to external factors such as static forces, vibrations, and temperature changes (FEA and… Show more -- Optical module package design: Substrate design, mechanical housing design and GD&T using CAD (SolidWorks) -- Optical module assembly flow design: Die bond, wire bond, SMT, 6-DOF active alignment process, UV curing epoxy material selection, UV cure recipe development, adhesive bonding of optical components -- Optomechanical design: Alignment tolerance analysis when optical train is subject to external factors such as static forces, vibrations, and temperature changes (FEA and Zemax). -- OSAT vendor management: Setting up SOW, MSA, and work with large-scale OSAT to drive optical module manufacturing from NPI to HVM -- Optical module MFG data collection, data management and data analytics for production yield improvement and process excursion FA (JMP, Python)

• Senior Packaging Engineer

  • Feb 2019 - Feb 2022

  - IC packaging design, silicon integration, packaging process design (flip chip, wire bond, copper pillar) - IC Package failure characterization and failure analysis - IC package thermal and thermomechanical Finite Element Analysis (FEA) using ANSYS - Photonic package/module design requiring precise alignment between photonic devices and fiber arrays - Tolerance and yield analysis of photonic package design backed by thermal and thermomechanical FEA -… Show more - IC packaging design, silicon integration, packaging process design (flip chip, wire bond, copper pillar) - IC Package failure characterization and failure analysis - IC package thermal and thermomechanical Finite Element Analysis (FEA) using ANSYS - Photonic package/module design requiring precise alignment between photonic devices and fiber arrays - Tolerance and yield analysis of photonic package design backed by thermal and thermomechanical FEA - Manufacturability assessment and improvement based on assembly yield and cost scaling



University of Michigan - Rackham Graduate School

• United States
• Higher Education
• 200 - 300 Employee

• Research Assistant in the Thermal Physics Group - Mechanical Design and Testing

  • Sep 2014 - Jan 2019

  Ophthalmic Device Thermal Architecture - Designed and fabricated an small medical device that can rapidly and precisely manipulate the temperature of small biological tissues - Validated the thermal performance of the medical device with FEA simulation and thermal metrology tests - The electronic device has commercial value as a means to induce rapid cryo-anesthesia when placed in contact with human body (skin, cornea, etc.), effectively easing soreness during needle… Show more Ophthalmic Device Thermal Architecture - Designed and fabricated an small medical device that can rapidly and precisely manipulate the temperature of small biological tissues - Validated the thermal performance of the medical device with FEA simulation and thermal metrology tests - The electronic device has commercial value as a means to induce rapid cryo-anesthesia when placed in contact with human body (skin, cornea, etc.), effectively easing soreness during needle injection Thermal Imaging System Design and troubleshooting - Devised a high spatial resolution (0.4μm) CCD-camera-based thermal imaging system that non-invasively characterizes the temperature profile of electronics with ~0.05K accuracy, enabling thermal characterization at the submicron scale - Integrated data acquisition system, instrument drivers and user interface in LabVIEW, automating the measurement process - Characterized temperature distribution in high-power diode lasers to shed light on improving device reliability against back-irradiance

• Heatsink Design and Optimazation for Wearable Electronics and Intel Chips

  • Sep 2014 - Jan 2019

  Thermal Management of Chips for Mobile Platforms - Integrated phase change materials into a mobile chip package and determined through extensive thermal testing that the PCM can help reduce chip peak temperature by ~14%, lifting thermal limitations to enhance the computation power under stringent volume constraints - Performed FEA in COMSOL to optimize the integration of PCMs into an Intel processor, successfully extending the chip residency time (time taken by the chip to reach maximum… Show more Thermal Management of Chips for Mobile Platforms - Integrated phase change materials into a mobile chip package and determined through extensive thermal testing that the PCM can help reduce chip peak temperature by ~14%, lifting thermal limitations to enhance the computation power under stringent volume constraints - Performed FEA in COMSOL to optimize the integration of PCMs into an Intel processor, successfully extending the chip residency time (time taken by the chip to reach maximum allowable temperature) by ~300% which permits prolonged turbo-boost High Thermal Conductivity Polymers - Engineered and fabricated a ground-breaking polymer using solution-cast which exhibits a thermal conductivity 6 times greater than that of other polymers, making it a candidate for flexible thermal interface material - Conducted 3-omega measurements to evaluate the thermal conductivity of thin polymer films (<100 nm)



UC Irvine

• United States
• Higher Education
• 700 & Above Employee

• Project Team Member in UCI FASE Racecar Project

  • Sep 2012 - Jan 2013

  - Key designer in reshaping the racecar to reduce frontal pressure and drag through CFD modeling of the air flow around the vehicle. - Collaborated with other team members in designing a light-weight and high throughput drive-train with optimized gear ratio. This effort led to a chain-sprocket drive line that relies on the proper leaning angle of the racecar for taking turns and increased its turning speed by 30%. - Key designer in reshaping the racecar to reduce frontal pressure and drag through CFD modeling of the air flow around the vehicle. - Collaborated with other team members in designing a light-weight and high throughput drive-train with optimized gear ratio. This effort led to a chain-sprocket drive line that relies on the proper leaning angle of the racecar for taking turns and increased its turning speed by 30%.