Experience

ALi Corporation

• Semiconductor Manufacturing
• 100 - 200 Employee

• Principal RF analog designer

  • Aug 2015 - Present

  Design of a single and dual satellite low noise block downconverter in the Ku band frequency range

• Senior RF analog designer

  • Jan 2013 - Aug 2015

  Develop a L band satellite tuner



Kudelski Group

• Switzerland
• Information Technology & Services
• 200 - 300 Employee

• RF Analog designer

  • Dec 2005 - Dec 2012

  In a small design team we have developed an DVB RF Tuner in 90 nmtechnology. I have participated at each conception step: - take in place verification CAD Flow in particular LVS, DRC and extraction. - Design and Layout of diiferrent blocks ( Low pass Filter calibration, Baseband Amplifier, high speed divider, DAC, Antenna tunning Control, VCO....) - Top Level simulation with Fast spice simulator - Check Filling and Cheesing after foundry post processing. … Show more In a small design team we have developed an DVB RF Tuner in 90 nmtechnology. I have participated at each conception step: - take in place verification CAD Flow in particular LVS, DRC and extraction. - Design and Layout of diiferrent blocks ( Low pass Filter calibration, Baseband Amplifier, high speed divider, DAC, Antenna tunning Control, VCO....) - Top Level simulation with Fast spice simulator - Check Filling and Cheesing after foundry post processing. - Measurement and Characterisation Show less In a small design team we have developed an DVB RF Tuner in 90 nmtechnology. I have participated at each conception step: - take in place verification CAD Flow in particular LVS, DRC and extraction. - Design and Layout of diiferrent blocks ( Low pass Filter calibration, Baseband Amplifier, high speed divider, DAC, Antenna tunning Control, VCO....) - Top Level simulation with Fast spice simulator - Check Filling and Cheesing after foundry post processing. … Show more In a small design team we have developed an DVB RF Tuner in 90 nmtechnology. I have participated at each conception step: - take in place verification CAD Flow in particular LVS, DRC and extraction. - Design and Layout of diiferrent blocks ( Low pass Filter calibration, Baseband Amplifier, high speed divider, DAC, Antenna tunning Control, VCO....) - Top Level simulation with Fast spice simulator - Check Filling and Cheesing after foundry post processing. - Measurement and Characterisation Show less



Philips

• Netherlands
• Hospitals and Health Care
• 700 & Above Employee

• Internship (ENSERG 2nd year)

  • Feb 2005 - Jul 2005

  Optimization of wireless CDMA transceiver with a new passive integration method based on thin film technology called PICS (passive integration connective substrate): - Co-simulation of passive and active dies ( two technologies: BiCMOS and PICS). - Study of CDMA receiver to see passive components which could be integrated. - Measurement of RF performances (NF, IIP3, gain…) on silicon and comparison with simulation. - Modification of active die (LNA, mixers) to have better… Show more Optimization of wireless CDMA transceiver with a new passive integration method based on thin film technology called PICS (passive integration connective substrate): - Co-simulation of passive and active dies ( two technologies: BiCMOS and PICS). - Study of CDMA receiver to see passive components which could be integrated. - Measurement of RF performances (NF, IIP3, gain…) on silicon and comparison with simulation. - Modification of active die (LNA, mixers) to have better performances. Learned skills: System knowledge (ZIF receiver), RF design (LNA, mixer), Instrumentation (noise and S parameters measurements), Electromagnetic simulation. Show less Optimization of wireless CDMA transceiver with a new passive integration method based on thin film technology called PICS (passive integration connective substrate): - Co-simulation of passive and active dies ( two technologies: BiCMOS and PICS). - Study of CDMA receiver to see passive components which could be integrated. - Measurement of RF performances (NF, IIP3, gain…) on silicon and comparison with simulation. - Modification of active die (LNA, mixers) to have better… Show more Optimization of wireless CDMA transceiver with a new passive integration method based on thin film technology called PICS (passive integration connective substrate): - Co-simulation of passive and active dies ( two technologies: BiCMOS and PICS). - Study of CDMA receiver to see passive components which could be integrated. - Measurement of RF performances (NF, IIP3, gain…) on silicon and comparison with simulation. - Modification of active die (LNA, mixers) to have better performances. Learned skills: System knowledge (ZIF receiver), RF design (LNA, mixer), Instrumentation (noise and S parameters measurements), Electromagnetic simulation. Show less



Orange

• France
• Telecommunications
• 700 & Above Employee

• Internship (ENSERG 1st year)

  • Jul 2004 - Sep 2004

  In the UMTS division with project manager of the new platform (Video telephony, video mail box, streaming) I was in charge of the test of the third generation services on the new mobile phones. Learned skills: UMTS network, 3G mobile phones. In the UMTS division with project manager of the new platform (Video telephony, video mail box, streaming) I was in charge of the test of the third generation services on the new mobile phones. Learned skills: UMTS network, 3G mobile phones.