Experience

UMC

• United Kingdom
• Musicians
• 1 - 100 Employee

• Section Manager

  • Sep 2013 - Present

  KLA, TENCOR inspection hardware maintenance and inspection recipe setup, AMAT SEMVISON SOP setup. • L4x BEOL defect and yield improvement. • L28 BEOL defect and yield improvement. KLA, TENCOR inspection hardware maintenance and inspection recipe setup, AMAT SEMVISON SOP setup. • L4x BEOL defect and yield improvement. • L28 BEOL defect and yield improvement.



Qualcomm

• United States
• Telecommunications
• 700 & Above Employee

• Senior Engineer

  • Oct 2011 - Mar 2013

  Mirosal technology 5.7 inch panel product failure analysis, color performance improvement, yield improvement and DOE handle. • Orbotech inspection recipe setup. • Glass Plate inline defect inspection and particle source verification. Mirosal technology 5.7 inch panel product failure analysis, color performance improvement, yield improvement and DOE handle. • Orbotech inspection recipe setup. • Glass Plate inline defect inspection and particle source verification.

• Staff Engineer

  • Nov 2006 - Sep 2011

  KLA, TENCOR inspection hardware maintenance and inspection recipe setup, AMAT SEMVISON defect review and recipe setup. • L90, L65 SCRBER process step modify. • L65 Cu void gap fill improvement. • L65, L55 FAB BEOL defect monitor and monitor process flow setup. • L65, L55 defect root cause finding and CP yield improvement. • BEOL wafer edge study and yield improvement by bevel clean. • L55 strain masking root course finding. • L45, L40 FAB BEOL defect monitor and BKM recipe study. • L45 Ti BEOL defect reduction & yield improvement (owner). • L40 XiX BEOL defect reduction yield improvement (Backup owner) Show less