Experience

Butterfly Network, Inc.

• United States
• Medical Equipment Manufacturing
• 200 - 300 Employee

• Technical Program Manager

  • Aug 2020 - Present

  Manage program of new hardware component introductionSupplier management

• Supplier Quality Engineer

  • Oct 2019 - Aug 2020

  Supplier quality managementNew product risk assessment/ new process qualification



TDK InvenSense

• United States
• Semiconductor Manufacturing
• 500 - 600 Employee

• Packaging Development Engineer

  • Jul 2018 - Oct 2019

  Assembly package development MEMS pressure sensor/ MEM Microphone/ MEMS motion sensor development Supplier management (QCDST) Quality incidents management Leading supplier/customer audits (ISO9001/IATF16949 certification) New materiel/ machine / process development Assembly package development MEMS pressure sensor/ MEM Microphone/ MEMS motion sensor development Supplier management (QCDST) Quality incidents management Leading supplier/customer audits (ISO9001/IATF16949 certification) New materiel/ machine / process development



ASE Global

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Senior Package Engineer

  • 2014 - 2018

  Support NPI projectsQuality management Process improvement

• Process Integration Engineer, Back-End

  • 2012 - 2014

  Back-end process integrationExperienced in mold, laser mark, package saw and AOI process

• Process Engineer, Front-End

  • 2011 - 2012

  Assembly front end process developmentExperienced in wafer dicing and die attaching process