Experience

OsecoElfab

• Industrial Machinery Manufacturing
• 1 - 100 Employee

• Senior Process Engineer

  • Oct 2004 - Present

  • Product design, manufacture and testing and new product introductions • Process development and new process introductions • Equipment, tooling and fixture design. • Process specialist for graphite products and EB welding cells. • Rupture disc sizing and design calculations in accordance with ISO, API and ASME standards (single phase and 2 phase flow pressure relief scenarios) • Explosion vent sizing to VDI and NFPA standards • Production support to all manufacturing departments • Technical support to sales and marketing departments • Factory shop floor layouts • Maintenance support • CAD – AutoCAD (2D) and SolidWorks (3D) • Systems engineering and project management - Halma Certificate in Applied Technology Show less



Connor Solutions Ltd

• Houghton-Le-Spring, Tyne and Wear

• Engineering Team Leader

  • Oct 2000 - Sep 2003

  Management of a small engineering team within one of the companies 2 business units. Overall responsibility for all processes, equipment and resources within the business unit. New product/process introductions, capital budgets and expenditure, design and control of all tooling, fixtures and procedures, site maintenance including the introduction of a computer based PPM system. Supplier auditing. Monitoring and improvement of business unit KPI's. Management of a small engineering team within one of the companies 2 business units. Overall responsibility for all processes, equipment and resources within the business unit. New product/process introductions, capital budgets and expenditure, design and control of all tooling, fixtures and procedures, site maintenance including the introduction of a computer based PPM system. Supplier auditing. Monitoring and improvement of business unit KPI's.



Welwyn Systems Ltd

• Blyth, Northumberland

• Senior Process Development Engineer

  • Dec 1998 - Oct 2000

  Wave solder specialist, process development and support for the manual PCB and box build assembly areas, yield improvement, cycle time reduction, shop floor layouts, Capital requests/justifications, tooling design, operating procedures creation and maintenance, creation of company wide operator certification program. Wave solder specialist, process development and support for the manual PCB and box build assembly areas, yield improvement, cycle time reduction, shop floor layouts, Capital requests/justifications, tooling design, operating procedures creation and maintenance, creation of company wide operator certification program.



Siemens Microelectonics Ltd

• North Tyneside, Tyne and Wear

• Production Engineer

  • Oct 1996 - Dec 1998

  Responsible for the day to day supervision of the Ion Implant manufacturing team. Training of all production operators during the plant start up phase. Duplication of all Ion Implant operations from the sister plant in Dresden to the North Tyneside facility. OEE improvements, ISO 9000 qualification, health and safety and operator appraisals. Responsible for the day to day supervision of the Ion Implant manufacturing team. Training of all production operators during the plant start up phase. Duplication of all Ion Implant operations from the sister plant in Dresden to the North Tyneside facility. OEE improvements, ISO 9000 qualification, health and safety and operator appraisals.



Hughes Microelectronics Ltd

• Glenrothes, Fife, Scotland

• Development Engineer

  • Dec 1988 - Oct 1996

  Evaluation of new encapsulation materials and processing equipment. Development of fine pitch interconnection processes and products. Development of nickel/gold bump technology used for flip-chip interconnect. Trouble shoot process and material issues within the main manufacturing divisions (PCB, Thick Film Hybrids & Semiconductors). Assist with the writing of patent applications on behalf of the company. Evaluation of new encapsulation materials and processing equipment. Development of fine pitch interconnection processes and products. Development of nickel/gold bump technology used for flip-chip interconnect. Trouble shoot process and material issues within the main manufacturing divisions (PCB, Thick Film Hybrids & Semiconductors). Assist with the writing of patent applications on behalf of the company.



Marconi Space and Defence Ltd

• Dalgety Bay, Fife, Scotland

• Mechanical Technician Apprentice/Process Engineer

  • Aug 1982 - Dec 1988

  Received broad engineering training in metal fabrication, welding and machining during the apprenticeship. Process monitoring within the PCB fabrication plant including;- chemical analysis of copper, tin/lead, nickel, gold plating/etching lines and also the effluent plant, monitoring of CNC drill and plasma etch processes, monitoring of photo lithography and silk screen processes. Writing of work instructions and training new staff. Received broad engineering training in metal fabrication, welding and machining during the apprenticeship. Process monitoring within the PCB fabrication plant including;- chemical analysis of copper, tin/lead, nickel, gold plating/etching lines and also the effluent plant, monitoring of CNC drill and plasma etch processes, monitoring of photo lithography and silk screen processes. Writing of work instructions and training new staff.