Bo Zhou
Senior Engineer , Package Team Leader at Fingerprint Cards- Claim this Profile
Contact Information
us****@****om
(386) 825-5501
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Location
Suzhou, Jiangsu, China, CN
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Experience
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Fingerprint Cards
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Sweden
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Semiconductor Manufacturing
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100 - 200 Employee
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Senior Engineer , Package Team Leader
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Apr 2021 - Present
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Package Team Leader
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Aug 2019 - Present
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Package Development Engineer
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Aug 2017 - Aug 2019
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昆山丘钛微电子科技有限公司
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China
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Semiconductor Manufacturing
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Package Development Engineer
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Jul 2016 - Jul 2017
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China Wafer Level CSP Ltd.
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Semiconductor Manufacturing
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1 - 100 Employee
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Package Process Integration Engineer Team Leader
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Apr 2014 - Jul 2016
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Package Process Integration Engineer
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Apr 2013 - Apr 2014
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Education
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2006 - 2010
安徽工业大学
学士学位, 电子信息工程
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