Benson Lin

TD Engineer at Win Semiconductors Corp. 穩懋半導體股份有限公司
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Contact Information
us****@****om
(386) 825-5501
Location
Taiwan, TW
Languages
  • 日文 Limited working proficiency
  • 英文 Limited working proficiency

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Experience

    • United States
    • Semiconductors
    • 200 - 300 Employee
    • TD Engineer
      • Mar 2018 - Present

    • Media Production
    • Senior Engineer
      • Aug 2015 - Feb 2018

      10G DFB for XGPON - Product trial run from wafer to TO-can verificationActively involved in - Production reliability test - Failure analysis and investigation - Eye diagram measurement and analysis 10G DFB for XGPON - Product trial run from wafer to TO-can verificationActively involved in - Production reliability test - Failure analysis and investigation - Eye diagram measurement and analysis

    • United States
    • Telecommunications
    • 100 - 200 Employee
    • Product Development Engineer
      • Oct 2011 - Jul 2015

      25G EML for 10km LAN WDM - III-V semiconductor process development and mask pattern design - Mapping data analysis and chip yield improvement with MatlabE-beam writer Project and holographic system - Pattern design and grating process improvement 25G EML for 10km LAN WDM - III-V semiconductor process development and mask pattern design - Mapping data analysis and chip yield improvement with MatlabE-beam writer Project and holographic system - Pattern design and grating process improvement

Education

  • National Sun Yat-sen University
    Master of Scince, Department of Photonics
    2009 - 2011
  • Feng Chia University
    Bachelor's degree, Electric Engineering
    2003 - 2007

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