Benson Lai
Principal Field Application Engineer at 台灣亞德諾半導體(Analog Devices Taiwan)- Claim this Profile
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Bio
Experience
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台灣亞德諾半導體(Analog Devices Taiwan)
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Taiwan
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Semiconductor Manufacturing
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1 - 100 Employee
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Principal Field Application Engineer
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Sep 2021 - Present
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Maxim Integrated
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Principal Field Application Engieer
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Sep 2017 - Oct 2021
* Win Start Award
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Senior Field Application Engineer
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Sep 2014 - Sep 2017
Design in Vcore power solution, DC-DC converter, gauge, audio solution, multiplexer, sensor and PMIC in Quanta, Foxconn and Mitac. Design in POE, Femto cell transceiver, charger, energy measurement, audio, DC-DC converter solution in Gemtek, Alphanetwork, mitrastar and sercomm New product promotion. Great team work coordinated capability, with rich working experience in co-work with US, and Taiwan Sales, CAE, FAE, Marketing team for goal accomplishment. Coordinate and collaborate with internal functions to maximize the customer satisfaction. Set up the strategic plan with the team in the target market segments. Analyze the business situation and find out inside information then provide a strategy for different occasions. Show less
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Fied Applicaion Engieer
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May 2010 - Sep 2014
*Design and support NB DC/DC and CPU power solution.
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Senior application Engineer
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Feb 2006 - Apr 2010
Product definer for DC-DC product and mix-signal product Product evaluation. Provide technical advice and application fix. Design application circuits & PCB layout, component selection, circuit optimization. Write application notes and datasheet for publication on component website. Build spice model and mathcad model for product simulation Co-work with marketing, FAE, IC designer for goal accomplishment. Create training material and launch pack for marketing and sales. Show less
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Education
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National Chung Cheng University
Master's degree, Electrical and Electronics Engineering -
Chung Yuan Christian University
BS, Electrical and Electronics Engineering