Bennett Burke

Principal Product / Process Engineer at Raytheon Technologies
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Contact Information
us****@****om
(386) 825-5501
Location
US
Languages
  • English -
Skills

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Joe Devaney

Bennett is a great guy with excellent management skills. Bennett is very technical oriented with a background in all aspects of electronics and mechanical manufacturing. Bennett was a fair, consistent and great manager, supporting his staff and always available to help and support his staff. Regards, Joe Devaney Product Engineer Alcatel-Lucent

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Credentials

  • Active DoD Security Clearance
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  • Basis of Estimate (BOE) Training
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  • Earned Value Management (EVM) certification
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  • Front Line Leadership Training
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  • IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies
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  • IPC-A-610, Acceptability of Electronic Assemblies
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  • Integrated Product Team (IPT) Program Leadership Training
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  • Raytheon Six Sigma Specialist
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Experience

  • Raytheon Technologies
    • United States
    • Aviation and Aerospace Component Manufacturing
    • 700 & Above Employee
    • Principal Product / Process Engineer
      • Jul 2019 - Present

      Raytheon Intelligence & Space

    • Team Leader / Principal Manufacturing Process Engineer
      • 2011 - Jul 2019

      • Rotated from manufacturing operations to engineering to fill an immediate technical need.• Supervise team of 8 manufacturing process engineers as a Team Leader. Create work instructions and shop procedures for operators, create machine programs for automation, and support McKinney IDS Circuit Card Assembly manufacturing processes.• Decreased Defects per Million Opportunities (DPMO) by 71% from 585 to 168 by leading a cross-functional Defect Prevention Team.• Decreased rework by 63.6% (from 5.5% to 2.0%) by leading cross-functional team focused on the process steps creating the most rework hours.• Achieved Raytheon Technical Honors award.• Achieved ROI of 80% on $800K capital project by managing project and tracking procurement, shop floor rearrangement, equipment validation, and training.• Changed status quo by introducing new software to create machine programs for automation, design stencils, and create work instructions.• Improved processes by leading more than 30 cross-functional Root Cause and Corrective Action teams.• Eliminated backlog of aging manufacturing trouble tickets from high of 225.• Contributed to Supplier Quality reviews of external CCA suppliers as a CCA expert.• Generate engineering labor estimates and budgets for new builds, changes, and proposals.• Reduced manufacturing readiness cycle time by 47% for prototypes and engineering revision changes on production assemblies. Show less

    • Manager II, Manufacturing
      • 2008 - 2011

      • In McKinney IDS Circuit Card Assembly, supervised 4 Facilitators/Supervisors and 48 hourly associates. Managed two surface mount lines, through-hole assembly line, selective solder line, manual SMT operations, and conformal coat area. High-mix, low-volume manufacturing.• Reduced cycle time by 80% from 5.2 days down to 1.0 day – kit release through surface mount assembly area – calculated using Little’s Law.• Achieved and maintained a monthly average SMT line changeover time of 30 minutes or less.• Achieved Earned Value Management (EVM) certification.• Reduced dollars written off at inventory time by 96% by implementing floor stock replenishment triggers and physical inventory requirements.• Introduced the first Visual Control Board on the CCA factory floor in the automated surface mount area. Also, introduced other Lean manufacturing initiatives. Show less

  • Nokia
    • Finland
    • Telecommunications
    • 700 & Above Employee
    • Manager, Product Engineering
      • 2003 - 2008

      • Defined responsibilities for and led engineering team formed from merger – 12 engineering team members were in Texas, California, Massachusetts, North Carolina, and Ontario.• Achieved the transfer of over 400 CCA part numbers in less than two years from Texas prototype/low-volume facility to high-volume facilities worldwide.• Formed and led cross-functional engineering teams from merged companies to standardize design rules and guidelines.• Solved external quality issues; maintained and enforced design rules and application guidelines for CCA designs and mechanical designs (modules, shelves, racks, enclosures).• Contributed support to Design for Manufacturing (DFM), Design for Everything (DFx), New Product Introduction (NPI), prototypes, and full product life cycle (R&D concept, manufacturing, end of life). Show less

    • Manager, Manufacturing
      • 2000 - 2003

      • Supervised 125 direct hourly employees, 7 salaried planners and team leaders. Directed shop scheduling, material movement, inventory control, and staffing plans in surface mount manufacturing and test areas. Managed three complete assembly lines each with surface mount, through hole, hardware, and in-circuit test (ICT).• Reduced Surface Mount Technology (SMT) factory annual spending by 66%.• Eliminated factory work orders open more than 30 days - from high of 200.• Eliminated non-netting board inventory - from high point of $256K.• Achieved average cycle time less than 2 days in a high-mix/low-volume SMT factory.• Introduced team-based work cells, which replaced former supervisory structure. Show less

Education

  • University of Louisiana at Lafayette
    BS Mechanical Engineering, CAD/CAM Option

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