Ben Lim

Market Segment Manager at Heraeus Electronics
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Contact Information
us****@****om
(386) 825-5501
Location
SG
Languages
  • English -
  • Chinese -
  • Japanese -

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Aanandha Selvaraj , PMP

Ben Lim is an excellent leader who possess fine technical acumen. Working with him in Showa Denko R&D,he constantly displayed his keen analytical mind by developing Magnetic designs for future generation of Hard disk. Coupled with his deep technical knowledge he also showed great leadership soft skills inspiring his team to further heights and break throughs. His exemplary work ethic made him a delight to work with as team lead or teammate

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Credentials

  • Product Management
    Singapore Management University
    May, 2022
    - Nov, 2024
  • Change Management Foundations
    LinkedIn
    Apr, 2020
    - Nov, 2024
  • Six Sigma: Green Belt
    LinkedIn
    Mar, 2020
    - Nov, 2024
  • Data Science & Analytics Career Paths & Certifications: First Steps
    LinkedIn
    Feb, 2020
    - Nov, 2024
  • Operational Excellence Foundations
    LinkedIn
    Feb, 2020
    - Nov, 2024
  • Six Sigma Foundations
    LinkedIn
    Feb, 2020
    - Nov, 2024

Experience

  • Heraeus Electronics
    • Germany
    • Appliances, Electrical, and Electronics Manufacturing
    • 100 - 200 Employee
    • Market Segment Manager
      • May 2022 - Present

      • Define, develop, and activate market segment strategies for semiconductor packaging• Idea generation and project management working with R&D Innovation teams• New technology scouting

    • Global Product Manager
      • Dec 2020 - Dec 2022

      • Incubator product management for advanced packaging materials• Product management for miniLED and microLED applications• Leads PDP (Product Development Process) and TD (Technical Development)

  • MediaTek
    • Taiwan
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • SoC Design Methodology
      • Sep 2020 - Nov 2020

      • In-charge of Co-Design - Bump/RDL routing, PG mesh, floor planning using ICC2 • Power integrity signoff • In-charge of Co-Design - Bump/RDL routing, PG mesh, floor planning using ICC2 • Power integrity signoff

  • Delta Electronics
    • Taiwan
    • Appliances, Electrical, and Electronics Manufacturing
    • 700 & Above Employee
    • Assistant R&D Manager
      • May 2016 - Aug 2020

      • Lead an R&D team in developing next-generation semiconductor packaging technology• Project manager on new product qualification for power modules in automotive, servers, and consumer applications• Interface with customers and translate customer requirements into specifications during new product qualification • Co-ordinate in-depth study on core research areas in advanced packaging e.g. Material, interfacial study, mechanical stress, thermal and electrical simulation.

    • Principal Engineer
      • Oct 2012 - Apr 2016

  • Showa Denko HD Singapore Pte Ltd
    • Appliances, Electrical, and Electronics Manufacturing
    • 1 - 100 Employee
    • Senior R&D Process Engineer
      • May 2009 - Oct 2012

      • Lead role in improving magnetic performance through thin film sputtering process• Lead role in the improvement of carbon-related deposition (MCVD, N2-etching, Spt-C) for next-generation tribology• Interface with customers and translate customer requirements into specifications during new product qualification • Promote media technology roadmap and improvement plan to match customer drive qualification roadmap

    • Process Engineer
      • Nov 2003 - May 2009

Education

  • Lithan Academy Pte Ltd
    NICF-Diploma in Infocomm Technology, Data Science
    2020 - 2021
  • Nanyang Technological University
    Bachelor's Degree, Electrical and Electronics Engineering
    2001 - 2003

Community

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