Experience

GoerTek Inc.

• China
• Computers and Electronics Manufacturing
• 500 - 600 Employee

• Sr. Engineering Program Manager

  • Jul 2019 - Present



Applied Engineering

• San Jose, CA

• NPI Program Manager

  • Jun 2017 - Jul 2019

  • Manage all New Product Introduction (NPI) activities and lead cross functional team from Purchasing, Manufacturing Engineering and Sales to support various functions including process design, manufacturing documentation definition, production tooling design, process improvement, and sales-quotation. • Responsible for all phases of product development from customer quotation through shipment of first production build. • Develop program schedules to track their progress to ensure products are shipped on time with exceptional quality and performance. • Review customer design schematics, assembly instructions and bill of materials with engineering team to ensure on time deliverable for manufacturing pilot run and mass production. Show less



GoerTek Electronics, Inc.

• Santa Clara, CA

• Technical Program Manager

  • Nov 2016 - Jun 2017

  • In charge of overall project coordination between US-based customers and GoerTek China teams for consumer electronic products. • Responsible for developmental and mass production projects in terms of schedule, costs, materials, tooling, product tests, delivery and reporting. • In charge of overall project coordination between US-based customers and GoerTek China teams for consumer electronic products. • Responsible for developmental and mass production projects in terms of schedule, costs, materials, tooling, product tests, delivery and reporting.



TDK, Headway Technologies, Inc.

• Milpitas, CA

• QA/Characterization Engineer

  • Oct 2009 - Nov 2016

  • Responsible for wafer and backend slider yield improvement and quality control of manufacturing wafer production. • Provided wafer improvement plan and collaborated with manufacturing team for process optimization. • Performed failure analysis on defective wafers, identified root cause, provided corrective actions to resolve customer complaints, took preventive measures to avert future complaints, and clearly documented all feedback. • Responsible for wafer and backend slider yield improvement and quality control of manufacturing wafer production. • Provided wafer improvement plan and collaborated with manufacturing team for process optimization. • Performed failure analysis on defective wafers, identified root cause, provided corrective actions to resolve customer complaints, took preventive measures to avert future complaints, and clearly documented all feedback.



FormFactor Inc.

• Semiconductor Manufacturing
• 700 & Above Employee

• Sr. Electrical Design Engineer & Project Leader

  • 2004 - Aug 2010

  • Designed high performance probe cards (High speed design, WLBI, SoC, etc) based on design rules and CAD tools. • Provided engineering specifications and defined design capabilities to manufacturing engineering. • Analyzed design data (timing skew, frequency, etc.), evaluated component specifications, verified BOM/cost optimization and created design document. • Responsible for scheduling the design activities, monitoring the progress and timely resolution of all issues. • Designed high performance probe cards (High speed design, WLBI, SoC, etc) based on design rules and CAD tools. • Provided engineering specifications and defined design capabilities to manufacturing engineering. • Analyzed design data (timing skew, frequency, etc.), evaluated component specifications, verified BOM/cost optimization and created design document. • Responsible for scheduling the design activities, monitoring the progress and timely resolution of all issues.



NPTest

• Semiconductor Manufacturing

• Electrical Engineering Co-Op

  • 2003 - 2004

  • Experienced in Scanning Electron Microscope operation and analysis. • Utilized stroboscopic e-beam prober to acquire waveforms from various customer devices. • Used Focus Ion Beam (FIB) technology to perform repairs and edits on semiconductor devices. • Performed Laser Voltage Probing techniques for in-circuit waveform measurements. • Experienced in Scanning Electron Microscope operation and analysis. • Utilized stroboscopic e-beam prober to acquire waveforms from various customer devices. • Used Focus Ion Beam (FIB) technology to perform repairs and edits on semiconductor devices. • Performed Laser Voltage Probing techniques for in-circuit waveform measurements.