Benjamin III Asis
DevOps Engineer at Phitopolis- Claim this Profile
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Topline Score
Bio
Credentials
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AWS Certified Solutions Architect – Associate
Amazon Web Services (AWS)May, 2021- Nov, 2024 -
Cisco Certified Network Associate Routing and Switching (CCNA Routing and Switching)
CiscoDec, 2019- Nov, 2024
Experience
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Phitopolis
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Philippines
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IT Services and IT Consulting
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1 - 100 Employee
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DevOps Engineer
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Jul 2021 - Present
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Maxim Integrated
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Reliability Engineer
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2016 - Aug 2020
• Develop and execute qualification plans for new package and assembly processes and technologies• Evaluate quality and reliability of design and manufacturing process to ensure a robust technology is developed to meet customer needs.• Manage product, process, quality and reliability improvement projects• Develop stress test studies to understand reliability and failure issues that may affect silicon devices• Provides technical assessment on potential reliability issues encountered by manufacturing and defines stress test plans on package-related issues as a result of customer complaints.• Work with key stake holders on Qualification preparation and scheduling
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Analog Devices
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Reliability Engineer
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Aug 2014 - Aug 2016
Designed reliability tests to qualify new products, assembly and wafer fabrication processes, and material changes. Analyzed and interpreted reliability data to develop qualification plans, risk assessments and evaluation reports. Managed and worked with overseas partners to implement reliability testing, failure analysis and laboratory improvements. Provided technical assistance in solving quality issues such as failure analysis of customer-returned products and defined corrective actions to address root cause.
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Excelitas Technologies Corp.
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United States
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Appliances, Electrical, and Electronics Manufacturing
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700 & Above Employee
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Failure Analysis Engineer
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Apr 2013 - Apr 2013
Conducted failure analysis techniques such as three-point probing and parallel lapping to identify different types of defects (i.e. microcracks, lifted balls, wirebond failures). Observed different manufacturing processes of optoelectronic d *evices (dicing process, module process, molding and casting process). Executed failure analysis of customer-returned products as well as routine testing of optoelectronic products.
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Education
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University of Philippines - Los Banos, Laguna
BS Applied Physics, Materials Science