Benedict Chia

Order Management Specialist at WILLIAM-SONOMA STORES, INC
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Contact Information
us****@****om
(386) 825-5501
Location
SG

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Credentials

  • Emotional Intelligence
    RMIT University
    Apr, 2020
    - Nov, 2024
  • Managing Time and Priorities
    RMIT University
    Nov, 2019
    - Nov, 2024
  • Cross Cultural Communication
    RMIT University
    Sep, 2019
    - Nov, 2024
  • Making the Business Case
    RMIT University
    Sep, 2019
    - Nov, 2024
  • Academic Integrity Awareness
    RMIT University
    Aug, 2019
    - Nov, 2024
  • Information Literacy: Key Concepts
    RMIT University
    Aug, 2019
    - Nov, 2024

Experience

    • United States
    • Individual and Family Services
    • 1 - 100 Employee
    • Order Management Specialist
      • Jun 2021 - Present

    • China
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Associate Engineer
      • Nov 2017 - Mar 2019

      Associate Equipment Engineer (Wirebond) • Working inside cleanroom environment with ISO certification for manufacturing of Ball Grid Array(BGA) and Leaded(QFN) chips for clients in the Front of line(FOL) for units bonding • Performing conversion of K&S Equipment for BGA and QFN leaded products with respective wire bonding setup such as rail height and width adjustments, Pattern recognition, replacement of capillary, clamp calibration and heater block replacement • Setting of Alignment for operator point and reliable and unique eye point for respective bonders to allow proper indexing sequencing and preventing any damaged leadframe. • Performing proper buyoff measures of Ball Height, Ball Diameters, Vertical Loop clearance in conjunction with other test such as Ball pull, Wedge pull, Ground wire pull and Ball Shear Test to ensure buy-off for post conversion setup to ensure configurations and bonding parameters meets customers requirements and Quality Assurance(QA) specifications. • Analyzing of bonded units to ensure bonded wire is within Bonded passivated and non-passivated ring during inspection and no contamination during bonding process on buy off units. • Inspection of bonded strip units to ensure no damaged or saggy wires in respective with malformed ball or golf ball formed during bonding process and aluminum splash within the guard ring • Ensuring of various wire size such as 0.7m,0.8m,0.9 and 1.0m have consistency of 1 wire diameter with respective to the next wire diameters on the next bond pad opening(BPO) • Attend to any K&S bonders with errors and alarms, resolving them to ensure smooth production. • Monitor the status of all bonders, monitor and investigate repeated alarms along with the Process engineers to resolve the issue. • Additional ad-hoc task as assigned daily Show less

    • Singapore
    • Food and Beverage Services
    • 200 - 300 Employee
    • Technical Assistant
      • Aug 2012 - Feb 2013

      • Attend to our companies software and hardware related issues island-wide. Resolving and troubleshooting their issue both physically or remotely. • Assistant to Manager's secretaries, dealing with delivery order and the creation of invoices • Provide general admin support to the team as a floater. • Attend to our companies software and hardware related issues island-wide. Resolving and troubleshooting their issue both physically or remotely. • Assistant to Manager's secretaries, dealing with delivery order and the creation of invoices • Provide general admin support to the team as a floater.

Education

  • RMIT University
    Bachelor of Business Logistics & Supply Chain Management, Logistics, Materials, and Supply Chain Management
    2019 - 2021
  • SHATEC (Singapore Hotel and Tourism Education Centre)
    Diploma, Cooking and Related Culinary Arts, General
    2016 - 2017
  • Nanyang Polytechnic
    Diploma in Electrical, Computer and Communication Engineering
    2010 - 2012

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