Experience

ABC Assembly

• United States
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• MFG Engineer

  • Sep 2012 - Present

  • Cross-trained employees on IPC-A 610. • Provided technical support for the MFG. • Implemented working instructions for SMT Processes Cable Department. • Generates SMT program for Samsung placement machine. • Creates BOM using M1 Managements System. • Ordered Stencils and Wave Pallet Fixtures. • Cross-trained employees on IPC-A 610. • Provided technical support for the MFG. • Implemented working instructions for SMT Processes Cable Department. • Generates SMT program for Samsung placement machine. • Creates BOM using M1 Managements System. • Ordered Stencils and Wave Pallet Fixtures.



Suntronic

• Houston, Texas Area

• production manager

  • May 2011 - Aug 2012

  • Responsible for PCB daily production. • Cross-trained employees on IPC-A 610, HMP and gold soldering. • Assisting tech support. • Member of NPI team. • Trained operators on Wave and Selective Wave machine • Responsible for PCB daily production. • Cross-trained employees on IPC-A 610, HMP and gold soldering. • Assisting tech support. • Member of NPI team. • Trained operators on Wave and Selective Wave machine



Systronix

• Stafford, TX

• Production Supervisor

  • Mar 2010 - Apr 2011

  • Responsible for PCB daily production. • Implemented process documentation for PCB’s product. • Created program for SMT machine, AOI, and Flying probe. • Ordered Stencil and Pallet as needed. • Implemented Corrective Actions for discrepant issues. • Trained Lead operators and operators on various SMT machine. • Responsible for PCB daily production. • Implemented process documentation for PCB’s product. • Created program for SMT machine, AOI, and Flying probe. • Ordered Stencil and Pallet as needed. • Implemented Corrective Actions for discrepant issues. • Trained Lead operators and operators on various SMT machine.



TS3 Technology (formally Micropaq)

• Houston, Texas Area

• Process Engineer / Production Manager

  • Feb 2001 - Apr 2009

  • Oversaw day-to-day operations of all Manufacturing Processes in Surface Mount and Thru-hole Technologies. • Assisted in implementation of Six Sigma and Lean Manufacturing Processes. • Trained/certified factory and management teams on IPC-A-610D Standard. • Made acquisitions for new equipment to increase productivity. • Trained Lead operators and operators on various SMT and Thru-Hole equipment. • Managed the PCB department for over 5 years. • Implemented assembly’s processes to HMP and Hi-Temp Technology. • Responsible for laboring quotes. • Appointed key members to New Product Introduction (NPI) and Design For Manufacturing (DFM). • Improved manufacturing FPY (First Pass Yield) which resulted in increase in performance from 60% to 99%. • Implemented Corrective Actions for discrepant issues. Show less



Telxon

• Computer Hardware
• 1 - 100 Employee

• Process Engineer

  • Aug 1988 - Feb 2001

  • Provided technical support for the SMT Department. • Trained Lead operators and team members on various SMT equipment. • Implemented working instructions for SMT Processes. • Evaluated and appointed key members to New Product Introduction (NPI). • Successfully, helped reduce costs by more than $100,000 a year by reducing rework and PCB design issue. • Provided technical support for the SMT Department. • Trained Lead operators and team members on various SMT equipment. • Implemented working instructions for SMT Processes. • Evaluated and appointed key members to New Product Introduction (NPI). • Successfully, helped reduce costs by more than $100,000 a year by reducing rework and PCB design issue.