Experience

3DiS Technologies

• France
• Semiconductor Manufacturing
• 1 - 100 Employee

• CEO, Founder

  • Jan 2013 - Present

  3DiS Technologies offers an innovative packaging and 3D interconnect technology for the integration of miniaturized electronic systems and high performance 3D passive devices. Based on a reduced number of technological steps and perfectly adaptable to the constraints of the client's application, the proposed process is ideal for System-in-Package, Wafer-Level-Packaging and network sensors assembly. Our cost effective solution reduces time-to-market and leads to miniaturized and more efficient electronic systems. Show less



LAAS-CNRS

• France
• Government Administration
• 300 - 400 Employee

• Researcher

  • Nov 2010 - Dec 2012



LAAS-CNRS

• France
• Government Administration
• 300 - 400 Employee

• PhD. Thesis

  • 2006 - 2010

  Process development for 3D interconnects and High-Q inductive components (inductors, transformers) integration Process development for 3D interconnects and High-Q inductive components (inductors, transformers) integration



NXP acquires Freescale Semiconductor

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Research Engineer

  • Nov 2006 - Nov 2009

  Developing a technology to replace bond-wires with planar interconnects Developing a technology to replace bond-wires with planar interconnects