Experience

Movella

• United States
• Information Technology & Services
• 100 - 200 Employee

• Packaging Manager

  • Apr 2018 - Present

  1. New package and process development2. New Product Introduction (WLCSP/LGA/QFN basis)3. Package process optimization4. Assembly subcontractor management5. Package cost reduction and yield improvement

• Senior Packaging Engineer

  • May 2013 - Mar 2018

  1. Worldwide Supplier Management2. Low-cost supplier introduction and ramp up3. New Product Introduction (Laminated substrates,Lead-frame, and WLCSP basis)4. Establish the handling procedure of MEMS products5. Continuously improve and develop assembly process6. Handle process excursion and improve yield in production phase7. Support customer audit8. Co-work with FA team to handle RMA



ASE Global

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Technical Support Engineer

  • Aug 2011 - May 2013

  1. New Product Introduction (NPI) 2. Continuously improve and develop assembly process 3. Handle process excursion and improve yield in production phase 4. Support customer audit 1. New Product Introduction (NPI) 2. Continuously improve and develop assembly process 3. Handle process excursion and improve yield in production phase 4. Support customer audit