Art Gonsky

Filed Application Engineer at Renesas Electronics
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Contact Information
us****@****om
(386) 825-5501
Location
Vero Beach, Florida, United States, US

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Experience

    • Japan
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Filed Application Engineer
      • Jul 2022 - Present

      Florida, United States

    • Regional Distribution Manager
      • Jun 2021 - Sep 2022

      US of A I am very excited to announce that I started new job as RDM at Renesas Electronics. I cant wait to propel Renesas forward to higher earnings by utilizing wide and deep portfolio of Semiconductors. Below is just a small sample of what Renesas have and its expending portfolio weekly. Sensors: Digital Mass Flow Sensors, Indoor/Outdoor Air Quality, Time of Flight, Humidity and Temp… Communication: Cellular (CAT-M1), BLE, Wi-Sun, LoRA and more MCUs/MPUs: ARM and RISC based Power &… Show more I am very excited to announce that I started new job as RDM at Renesas Electronics. I cant wait to propel Renesas forward to higher earnings by utilizing wide and deep portfolio of Semiconductors. Below is just a small sample of what Renesas have and its expending portfolio weekly. Sensors: Digital Mass Flow Sensors, Indoor/Outdoor Air Quality, Time of Flight, Humidity and Temp… Communication: Cellular (CAT-M1), BLE, Wi-Sun, LoRA and more MCUs/MPUs: ARM and RISC based Power & Analog: Industrial Power Products, Ultra Low Quiescent (Iq) DC-DC, ADCs, Wireless charging and so much more RF: Mod/Demod, Amps, Attenuators, Mixers, Switches, Synthesizers & PLLs, VGAs Timing: largest portfolio from standard oscillators to programmable output fanout buffers, clock generators and jitter attenuators and more

    • United States
    • Semiconductors
    • 700 & Above Employee
    • Applications Manager & Marketing, Power Systems System Solution Group ON semiconductor
      • Nov 2017 - Mar 2021

      United States Responsible for supporting Applications of Power Devices such MOSFET’s, Silicon Carbide MOSFET’s, GaN MOSFET’s, IGBT’s, Galvanic Isolators, Operational Amplifiers, Voltage Regulators and ALL other devices from ON Semiconductor, for High Power Motor Drivers, Photovoltaic Panels, Battery Storage, Wind Turbines and Switching Power Amplifiers Class-D. Responsibilities also included supporting Top 3 Distributor, Arrow/Avnet/Future FAE’s and FSE’s in Americas, North and South. Position also was… Show more Responsible for supporting Applications of Power Devices such MOSFET’s, Silicon Carbide MOSFET’s, GaN MOSFET’s, IGBT’s, Galvanic Isolators, Operational Amplifiers, Voltage Regulators and ALL other devices from ON Semiconductor, for High Power Motor Drivers, Photovoltaic Panels, Battery Storage, Wind Turbines and Switching Power Amplifiers Class-D. Responsibilities also included supporting Top 3 Distributor, Arrow/Avnet/Future FAE’s and FSE’s in Americas, North and South. Position also was accountable for new application development with existing ON Semi devices as well as generating New Product Specifications across Business Units and create new applications based on that. Customer’s visits across the AMR GEO was priority as well as generating training Presentations in Microsoft Power Point. Training of Distribution Sales and FAE’s was based on quarterly bases as well as monthly via Remote. Responsible for keeping track and evaluation of Sales and Distribution design wins and translate for Business Units in regards to New Product utilization. Job also included promotion of System Level design support with current Device Portfolio and make sure that its fits well within Company forward progress. Working with Top Tier customers was Priority One and utilize New Product in future design at 3 – 5 years out. Travel was 40% and depending on training, showcases and Customer requests. Very close ties with Distribution as well as Direct Sales across AMR supports great progress and design wins. Show less

    • United States
    • Semiconductors
    • 700 & Above Employee
    • Applications Engineering Manager, System Solution Group
      • Jul 2012 - Mar 2017

      Japan, Tokyo/Florida, USA  Responsible for selecting and hiring Team Members and setting up multinational Application Engineering Departments in three Different Geo Locations; Japan, USA and EU. Currently leading Team of Eight Apps Engineers to work on wide power range of AC/DC and DC/DC LED driver products as well as Power FET’s, IGBT’s, Off-Line controllers and Total System Solutions, Motor Drivers for BLDC/Steppers and Brushed topology as well as new SW leading techniques with FOC and DTC algorithm… Show more  Responsible for selecting and hiring Team Members and setting up multinational Application Engineering Departments in three Different Geo Locations; Japan, USA and EU. Currently leading Team of Eight Apps Engineers to work on wide power range of AC/DC and DC/DC LED driver products as well as Power FET’s, IGBT’s, Off-Line controllers and Total System Solutions, Motor Drivers for BLDC/Steppers and Brushed topology as well as new SW leading techniques with FOC and DTC algorithm.  Responsibilities include Field Sales/FAE’s support and project definition per individual Application Engineer. Develop new Non-Isolated and Isolated topologies for LED Drivers and include US Mains at 115VAC as well as Industrial Voltages up to 560V and above. Include leading edge approach to PFC validation with Active and Passive circuitry, depending on Customer Specifications.  Responsible for Team Project Management and Technical Support to solve problems internally as well as in the field. Acting as advisor to applications engineering team regarding projects, tasks, and operations. Also part of the tasks is to collect customer data from the Field and initiate architecture and define the IC product together with IC design team.  Work closely with Semiconductor Design Engineers during New Product Development stage in order to evaluate Custom Application Testing and feedback results to Business Units for corrective actions as well as keep close communication with Top Tier leading Customers.  Overall integration of SANYO Semiconductor into ON Semi culture has delivered Design Wins as well as New Product introduction into $100 M US as well as Design Wins at Apple Inc.

    • Principal Field Application Engineer
      • Apr 2002 - Jul 2012

      Florida, United States  Responsible for supporting design win efforts for Complete Semiconductor Portfolio, including Power Management products for southeastern U.S. Region and Former Soviet Union Countries. Delivered Extensive interface, training and technical support with Manufacturer Reps and Distributors. Responsible for New Product Definition, deliver to Factory for eval and see through to the Release to Market. Provided design-in work to top tier clients including: RIM Corp, working on power… Show more  Responsible for supporting design win efforts for Complete Semiconductor Portfolio, including Power Management products for southeastern U.S. Region and Former Soviet Union Countries. Delivered Extensive interface, training and technical support with Manufacturer Reps and Distributors. Responsible for New Product Definition, deliver to Factory for eval and see through to the Release to Market. Provided design-in work to top tier clients including: RIM Corp, working on power architecture for Hand-Held Portable systems design. Design wins for SMPS and supporting components. Adtran, supported design on all of the Adtran products. Included design win for Dual DC/DC controller to be used on 90% of the current and future product. Motorola BCS, ESG and iDEN, Set Top box design, Battery Charging & Cell Phone. Distribution Power Architecture and most of discrete components. Sony-Ericsson, Work with Analog System Engineering to win designs on White LED drivers, Analog Filters, Buck & Boost converter as well as Power Management Unit (PMU’s) GE Electric, Work with GE resulted in the Design win for 3 power controllers in DC/DC field. I have also picked up discrete components on that design. Sienna , with high speed logic, Sienna was a perfect customer for design win in the clock fan out IC’s, Data processing IC’s for Backplane drivers and Receivers, Level Translators, Cross Point Switches and Mux/Demix IS’s. All this does not include Standard Logic that is used and had to be designed in trough out

    • Senor System Architect/Electronic Design Manager
      • Apr 1995 - Apr 2002

      Design and Development of Digital Set-Up Boxes (Digital Cable) and Digital Satellite Transceivers. Fully responsible for design of Switch Mode, 12 Output Power Supplies, AC-DC (PFC Included) as well as DC-DC internal converters @ 65-120 W. This Phase of Design included Selection of Topologies, best suited for Application, Performance/Price based components and taken to Final (Internal) Customer Acceptance with H.A.L.T. included. Responsibilities included Schematic Design, close working… Show more Design and Development of Digital Set-Up Boxes (Digital Cable) and Digital Satellite Transceivers. Fully responsible for design of Switch Mode, 12 Output Power Supplies, AC-DC (PFC Included) as well as DC-DC internal converters @ 65-120 W. This Phase of Design included Selection of Topologies, best suited for Application, Performance/Price based components and taken to Final (Internal) Customer Acceptance with H.A.L.T. included. Responsibilities included Schematic Design, close working relationship with PWB layout Department. Designed PWM SMPS and Full System to meet and exceed CISPR 22, Class B as well as FCC Part 15, EMC Compliance specifications. Have established good working relationship with UL and CSA as well as DIN and multitude of other Worldwide Safety Agencies. Support Manufacturing Ramp-Up during Pre-Production and Full Production. MFG Support included following up on “infant mortality” failures as well as their evaluation. Well versed in the Future of Power Supply Directions for Cost/Performance and Size Reduction upgrades. Made Decisions on in-house SMPS Build versus Outsourcing. In the case of Outsource, fully responsible for Specification creation, external design evaluation (down to component level), reliability evaluation (for prototype as well as trial run stages) and supporting paperwork to document failures and countermeasures. Complete Switch Mode Power Supply design for 21” and 24” CRT and TFT as well as Portable VAIO Computers. Designed products to meet and Exceed “Blue Angel” and “Energy Star” ratings. Development/Design with responsibilities for Architecture and ALL of the Power Supply Components. Coordinated Design Reviews, Internal and External, hands-on Trial Runs and Adherence to customer specifications as well as ALL Safety Agencies for Consumer Electronics/Industrial/Medical Products. Work well with Multicultural and Multidiscipline team of Engineers Show less

    • Senior Design Engineer
      • Dec 1987 - Jun 1997

      Greater Boston Area Coordinated and participated in the Design and Development of a Medium to Large sized Magnetic Resonance Imaging Power Systems with Laser Targeting and Inverter Based Power Supplies. MRI Requires D-Class, IGBT’s based High Power Switching Amplifiers that I was fully responsible for. Designed and Implemented Fully enclosed Rack Systems with Thermal Management and Heatsink selection integral to the Rack. Designed all of the aspects of the successful System/Component Level… Show more Coordinated and participated in the Design and Development of a Medium to Large sized Magnetic Resonance Imaging Power Systems with Laser Targeting and Inverter Based Power Supplies. MRI Requires D-Class, IGBT’s based High Power Switching Amplifiers that I was fully responsible for. Designed and Implemented Fully enclosed Rack Systems with Thermal Management and Heatsink selection integral to the Rack. Designed all of the aspects of the successful System/Component Level from Architecture to Prototype to Production including Power Electronics, from 250 W and up to 250 kW. Full Rack System would include 3-Axis Power Amplifiers as well as 600 V/10 AC to DC PWM Switch Mode Power Supply that was Designed and Developed by utilizing Working Model Creation, Prototype Debugging, Load Selection/Calibration as well as other Development duties. Support Failures in Manufacturing as well as the Customers Sites. Enjoyed Full responsibility for Schematic creation supervision, High Current, High-speed PWB layout and Component selection for Cost/Performance. Rack System included Full Thermal control with 16 Thermistors monitoring temperature as well as the Fan Speed. Full Rack Enclosure had to pass CISPR 22, Class “B” EMC Level (Europe requirement for Medical/Industrial products). Designed and implemented New Air Ram Control system to decrease EMC Emissions and keep cooling properly directed. Show less

Education

  • Kharkov Aviation Institute, Air Force affiliate
    MSEE, Electrical Engnieering, Power Semiconductors in Swithching Power Supplies
    1976 - 1980

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