Experience

Kinsus Interconnect Technology Corp.

• Taiwan
• Semiconductor Manufacturing
• 200 - 300 Employee

• Project Director, R&D

  • Feb 2022 - Present

• Senior Project Manager, R&D

  • May 2018 - Feb 2022

  Managed AiP (Antenna in Package) substrate technology.Headed 1st. mmWave AiP substrate to HVM from 2020.Integrated RF / SiP design rules and technology roadmap.

• Project Manager, Process Integration Engineering

  • Jun 2016 - May 2018

  Introduced mSAP and coreless technology to RF customer, HVM from 2017.Headed ultra-thin substrate developing, 30% board thickness reduction.Coordinated engineering resource for 50um blind via evaluating.

• Senior Assistant Project Manager, R&D

  • Jun 2010 - Jun 2016

  Developed embedded substrate for high-end AP and set up first production line.Developed thermal bar substrate for RF high power PA, HVM from 2012. Developed 1st. coreless substrate for RF high band PA and filter, HVM from 2010.

• Engineer ~ Assistant Project Manager, R&D

  • Jun 2003 - Jun 2010

  Factory layout planning and production line installation.TW factory : · Capacity expansion : From 2003 to 2005.· New factory for FCCSP : From 2006 to 2007.CN factory : · New factory for CSP from 2008 to 2010.Developed and established 1st. MMC production line.