Experience

StarHub

• Singapore
• Telecommunications
• 700 & Above Employee

• Connectivity Services, International Business. Assoc.Dir.

  • Apr 2021 - Present

  Product | Pricing | Procurement Lead a team of Product, Procurement and Commercial Managers for International Business & Wholesale Division. Let's connect and collaborate. Product | Pricing | Procurement Lead a team of Product, Procurement and Commercial Managers for International Business & Wholesale Division. Let's connect and collaborate.



Singtel

• Singapore
• Telecommunications
• 700 & Above Employee

• SDN & IP Services | Business Products | Product Manager

  • Apr 2020 - Apr 2021

  Drive SD-WAN solutions to entreprises and global corporations, assisting organisations achieve network transformation to evolve from the traditional WAN to a fluidic overlay network.

• Corporate SingNet | Business Products

  • May 2017 - Apr 2020

  Product Manager for fibre-based internet technologies and broadband services of Singapore's largest internet service provider. Championed multiple projects to achieve revenue growth and profitability for SingNet Multiplay targeting Enterprises and SMB segments.



StarHub

• Singapore
• Telecommunications
• 700 & Above Employee

• Commercial TV | Entertainment & SmartLife | Product Lead

  • Jun 2010 - Apr 2017

  Lead and Product Owner of StarHub TV on Cable and StarHub TV on Fibre platforms that powers content delivery to Corporations, Hospitality as well as SMBs including F&B establishments.

• International Managed Services | Products & Solutions | Asst. Manager

  • Jul 2007 - Jun 2010

  Product Manager to drive IMS partner services including Conferencing, Business Data i.e. BT MPLS & Business Voice i.e. BT CCS solutions to meet business KPIs such as operating revenue and profitability targets.



UTAC

• Semiconductor Manufacturing
• 700 & Above Employee

• Packaging Design & Analysis | Senior Design Engineer

  • Jun 2005 - Jul 2007

  Technologist and Designer of Plastic Ball Grid Array (PBGA) and Flip Chip (FCBGA) packages specialising in High Frequency Structure Simulations (HFSS). Technologist and Designer of Plastic Ball Grid Array (PBGA) and Flip Chip (FCBGA) packages specialising in High Frequency Structure Simulations (HFSS).



JCET Group

• China
• Semiconductor Manufacturing
• 700 & Above Employee

• Package Characterisation | Technology Engineer

  • Apr 2002 - May 2005

  Electrical Engineer specialising in analysis, modelling and characterisation of leaded and array packages to optimise high-speed substrate layout, faster design lead times and overall package performance. Electrical Engineer specialising in analysis, modelling and characterisation of leaded and array packages to optimise high-speed substrate layout, faster design lead times and overall package performance.