Akiyoshi Ide

Group manager, Fujiyoshida plant, Wafer division, Electronics business group at 日本ガイシ
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Contact Information
us****@****om
(386) 825-5501
Location
JP
Languages
  • Japanese Native or bilingual proficiency
  • English Full professional proficiency
  • Okinawa accent 沖縄方言 Limited working proficiency

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Credentials

  • TOEIC SCORE 915 (2012年)
    Toeic
  • X線主任
    -
  • 英検1級 Eiken 1st grade
    公益財団法人 日本英語検定協会

Experience

    • Japan
    • Glass, Ceramics and Concrete Manufacturing
    • 1 - 100 Employee
    • Group manager, Fujiyoshida plant, Wafer division, Electronics business group
      • May 2020 - Present

      Establishing the new Fujiyoshida plant for bonded wafer productionDevelopment of manufacturing technologies for bonded wafer products

    • Group Manager, Wafer division, Electronics business group
      • Apr 2019 - Apr 2020

      Development of manufacturing technologies for bonded wafers

    • Manager, Wafer division, Electronics business group
      • Apr 2017 - Mar 2019

      Development of manufacturing technologies for bonded wafers

    • President
      • Jun 2016 - Jun 2017

      Public speaking and leadership development Public speaking and leadership development

    • Manager, Wafer division, Electronics Business Group
      • Jul 2015 - Mar 2016

      Development of ceramic wafers for bonded wafer applications Development of ceramic wafers for bonded wafer applications

    • Manager, Global sales & marketing, Electronics Business Group
      • Apr 2014 - Jun 2015

      Overseas sales & marketing of composite wafer products for SAW and CMOS applications Overseas sales & marketing of composite wafer products for SAW and CMOS applications

    • Manager, Corporate R&D
      • Jan 2013 - Mar 2014

      Development of insulated substrate for RF-CMOS applications Development of insulated substrate for RF-CMOS applications

    • United States
    • Manufacturing
    • 1 - 100 Employee
    • Manager
      • 2008 - 2012

      Establish US research office, NGK-Corporate R&D - Market and technology research works with researching companies in US - Handling R&D collaboration works with US partner companies and universities - Ceramic wafers for RF-CMOS technology - Thin film solid state micro battery for mobile applications - Solid oxide fuel cells for stationary use - Ceramic honeycomb thermal exchanging substrate for automotive applications Establish US research office, NGK-Corporate R&D - Market and technology research works with researching companies in US - Handling R&D collaboration works with US partner companies and universities - Ceramic wafers for RF-CMOS technology - Thin film solid state micro battery for mobile applications - Solid oxide fuel cells for stationary use - Ceramic honeycomb thermal exchanging substrate for automotive applications

    • Principal Engineer
      • 1999 - 2008

      Development of optical fiber array for planar optical circuits Development of optical power monitor device Development of 40G optical modulator using LN thin film composite wafer technology Development of optical fiber array for planar optical circuits Development of optical power monitor device Development of 40G optical modulator using LN thin film composite wafer technology

Education

  • Mie University 三重大学
    Master 修士, Mechanical Engineering 機械工学
    1997 - 1999
  • University of the Ryukyus 琉球大学
    Bachelor 学士, Mechanical Engineering 機械工学
    1993 - 1997

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