John Abbott
Retired Engineer at JHA Consulting- Claim this Profile
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Bio
Greg Hotchkiss
It is my distinct privilege to provide a letter of reference for Mr. John Abbott. I have known John for over 20 years during our joint employment in the same department at Texas Instruments (TI). John was responsible for managing development focused projects that resulted in providing multiple generations of high performance, high power semiconductor microprocessor packaging for Sun (now Oracle). These packages were the most advanced and technically challenging of any at the current time at TI. To be successful, John had to be proficient in many diverse disciplines including project management, material development, customer and management communications, supplier engagements, manufacturing, and quality and reliability. John was able to draw upon these skills to provide timely solutions to meet very difficult requirements from a demanding customer. John is able to work effectively as an individual contributor or team leader. He works well within a team environment and is a thoughtful contributor of ideas that often leads to new approaches to solving a problem. John worked quite closely with TI’s internal assembly plant to assemble the Sun microprocessor packages. He and the manufacturing team were constantly overcoming typical and atypical manufacturing obstacles in order to meet Sun’s product demands at a cost affordable to TI. John is a dedicated and very diligent worker. His strong work ethics will provide a good example for others within any company..
Patrick Thompson
I worked closely with John as both his direct supervisor and a colleague for more than ten years at Texas Instruments. John's project management and communication skills made him an asset to any team. He is able to take complex information and create appropriate communication for various audiences including the work team, management, customers and suppliers. John is proactive and detail-oriented; with this combination, John can always be trusted to complete his projects in a comprehensive, error-free manner, without the need for undo follow up.
Greg Hotchkiss
It is my distinct privilege to provide a letter of reference for Mr. John Abbott. I have known John for over 20 years during our joint employment in the same department at Texas Instruments (TI). John was responsible for managing development focused projects that resulted in providing multiple generations of high performance, high power semiconductor microprocessor packaging for Sun (now Oracle). These packages were the most advanced and technically challenging of any at the current time at TI. To be successful, John had to be proficient in many diverse disciplines including project management, material development, customer and management communications, supplier engagements, manufacturing, and quality and reliability. John was able to draw upon these skills to provide timely solutions to meet very difficult requirements from a demanding customer. John is able to work effectively as an individual contributor or team leader. He works well within a team environment and is a thoughtful contributor of ideas that often leads to new approaches to solving a problem. John worked quite closely with TI’s internal assembly plant to assemble the Sun microprocessor packages. He and the manufacturing team were constantly overcoming typical and atypical manufacturing obstacles in order to meet Sun’s product demands at a cost affordable to TI. John is a dedicated and very diligent worker. His strong work ethics will provide a good example for others within any company..
Patrick Thompson
I worked closely with John as both his direct supervisor and a colleague for more than ten years at Texas Instruments. John's project management and communication skills made him an asset to any team. He is able to take complex information and create appropriate communication for various audiences including the work team, management, customers and suppliers. John is proactive and detail-oriented; with this combination, John can always be trusted to complete his projects in a comprehensive, error-free manner, without the need for undo follow up.
Greg Hotchkiss
It is my distinct privilege to provide a letter of reference for Mr. John Abbott. I have known John for over 20 years during our joint employment in the same department at Texas Instruments (TI). John was responsible for managing development focused projects that resulted in providing multiple generations of high performance, high power semiconductor microprocessor packaging for Sun (now Oracle). These packages were the most advanced and technically challenging of any at the current time at TI. To be successful, John had to be proficient in many diverse disciplines including project management, material development, customer and management communications, supplier engagements, manufacturing, and quality and reliability. John was able to draw upon these skills to provide timely solutions to meet very difficult requirements from a demanding customer. John is able to work effectively as an individual contributor or team leader. He works well within a team environment and is a thoughtful contributor of ideas that often leads to new approaches to solving a problem. John worked quite closely with TI’s internal assembly plant to assemble the Sun microprocessor packages. He and the manufacturing team were constantly overcoming typical and atypical manufacturing obstacles in order to meet Sun’s product demands at a cost affordable to TI. John is a dedicated and very diligent worker. His strong work ethics will provide a good example for others within any company..
Patrick Thompson
I worked closely with John as both his direct supervisor and a colleague for more than ten years at Texas Instruments. John's project management and communication skills made him an asset to any team. He is able to take complex information and create appropriate communication for various audiences including the work team, management, customers and suppliers. John is proactive and detail-oriented; with this combination, John can always be trusted to complete his projects in a comprehensive, error-free manner, without the need for undo follow up.
Greg Hotchkiss
It is my distinct privilege to provide a letter of reference for Mr. John Abbott. I have known John for over 20 years during our joint employment in the same department at Texas Instruments (TI). John was responsible for managing development focused projects that resulted in providing multiple generations of high performance, high power semiconductor microprocessor packaging for Sun (now Oracle). These packages were the most advanced and technically challenging of any at the current time at TI. To be successful, John had to be proficient in many diverse disciplines including project management, material development, customer and management communications, supplier engagements, manufacturing, and quality and reliability. John was able to draw upon these skills to provide timely solutions to meet very difficult requirements from a demanding customer. John is able to work effectively as an individual contributor or team leader. He works well within a team environment and is a thoughtful contributor of ideas that often leads to new approaches to solving a problem. John worked quite closely with TI’s internal assembly plant to assemble the Sun microprocessor packages. He and the manufacturing team were constantly overcoming typical and atypical manufacturing obstacles in order to meet Sun’s product demands at a cost affordable to TI. John is a dedicated and very diligent worker. His strong work ethics will provide a good example for others within any company..
Patrick Thompson
I worked closely with John as both his direct supervisor and a colleague for more than ten years at Texas Instruments. John's project management and communication skills made him an asset to any team. He is able to take complex information and create appropriate communication for various audiences including the work team, management, customers and suppliers. John is proactive and detail-oriented; with this combination, John can always be trusted to complete his projects in a comprehensive, error-free manner, without the need for undo follow up.
Experience
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JHA Consulting
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Internet Publishing
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1 - 100 Employee
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Retired Engineer
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Nov 2013 - Present
Materials science engineer and project manager specializing in semiconductor packaging and assembly. Materials science engineer and project manager specializing in semiconductor packaging and assembly.
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Texas Instruments
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Senior SC Packaging Flip Chip Engineer, Analog Division
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2010 - Oct 2013
Managed packaging needs to support high-frequency SERDES, DAC, and ADC requirements of analog packages as the newer devices moved into flip chip for improved performance. Defined packaging and qualification requirements of analog flip chip packages with subcontract suppliers, using their assembly technology to ramp products into production.
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Senior SC Packaging Flip Chip Engineer, High-Power Processor Division
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1996 - 2013
Developed materials and packages needed to support high-power, high-performance flip chip packages for each new generation of Sun Microsystems, SPARC processors. Extended existing packaging technologies for each generation as much as possible and identified whether each new product required additional development to meet new product specifications on time. Used materials science knowledge to aid in developing organic underfill & lid attach materials as well as developing CuW, AlSiC, & Cu lid materials for these products. Also worked with suppliers to transition our high power products from high temperature alumina ceramic substrates to lower temperature co-fired glass ceramics to attain the lower resistance copper based conductors in these substrates. Show less
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ASP Package Engineering Section Manager
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1988 - 1996
Managed the daily activities of a group of engineers and technicians split between Houston and Dallas, in supporting the needs of several product groups within the Application Specific Processor Group. Our team focus was on the production of molded, wire bonded, IC packages and improving yields.
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Package Engineering Manager
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1983 - 1988
Defined assembly requirements for new Programmable Products Division semiconductor packages at both local prototyping and off-shore production sites in Singapore and Philippines. Completed the production off-load from Singapore to the Philippines which included materials changes to increase product reliability. Reviewed and translated customer specifications into company documents for package assembly.
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Package Engineer
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1980 - 1983
Defined assembly requirements for new microcomputer and DSP semiconductor packages at both local prototyping and off-shore production sites in Singapore and the Philippines. This included work in developing thermoset molding compunds and epoxy die attach materials. Also worked with the production assembly site to develop silicone based overcoat mateirals & assembly processes in reducing the package stress on the die surface providing a temporary solution while the semiconductor fabs developed better protective oxides/nitrides to handle these stresses. Show less
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Compugraphic Corporation
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Mid Atlantic District
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Field Service Technician
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1975 - 1976
Traveled to customers in a 7 state area to troubleshoot and/or install electronic photo typesetting equipment. Traveled to customers in a 7 state area to troubleshoot and/or install electronic photo typesetting equipment.
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Education
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1976 - 1980
Penn State University
BS, Ceramic Science & Engineeering -
1973 - 1975
Penn Technical Institute, Pittsburgh, PA
Associates Degree, Electrical and Electronics Engineering
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