Experience

Dick Law Firm - 832LAWYERS

• United States
• Law Practice
• 1 - 100 Employee

• Associate

  • Mar 2015 - Present

  • Represent policyholders with first-party homeowners insurance claims. • Represent policyholders with first-party homeowners insurance claims.



Bashen Corporation

• Houston, TX

• EEO Consultant

  • May 2014 - Aug 2014

  • Investigated EEO complaints, interviewed witnesses, and drafted affidavits and final reports. • Investigated EEO complaints, interviewed witnesses, and drafted affidavits and final reports.



Providus

• Houston, TX

• Document Review Attorney

  • Nov 2013 - May 2014

  • Reviewed and classified client documents in preparation for asset transfer. • Reviewed and classified client documents in preparation for asset transfer.



Edmonds & Nolte, PC

• Houston, TX

• Legal Clerk

  • Oct 2012 - Jan 2013

  • Provided Intellectual Property litigation support, including performing research and drafting motions and responses. • Provided Intellectual Property litigation support, including performing research and drafting motions and responses.



Patterson + Sheridan, LLP

• United States
• Law Practice
• 100 - 200 Employee

• Summer Associate

  • Jun 2012 - Aug 2012

  • Drafted responses to Office Actions, opinion letters, and advisory letters to foreign affiliates. • Drafted and amended patent claims for new and pending patent applications. • Drafted responses to Office Actions, opinion letters, and advisory letters to foreign affiliates. • Drafted and amended patent claims for new and pending patent applications.



South Texas College of Law Houston

• United States
• Higher Education
• 200 - 300 Employee

• Research Assistant

  • May 2010 - Aug 2010

  • Researched a variety of legal subject matters. • Researched a variety of legal subject matters.



Spansion is Cypress Semiconductor

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Sr. Process Engineer

  • Apr 2003 - Jul 2008

  • Primary responsibilities included ownership and development of etch metrology and process control strategies. Tool owner and process engineer for CD-SEM, film thickness, scatterometry, and profiler metrology equipment. • Responsible for capital planning, evaluation, selection, purchase, installation, and qualification of CD-SEM, scatterometry, and film thickness metrology equipment for 90 and 65-nm technology nodes. • Etch technology transfer leader for 65-nm flash technology node. Assignment entailed acting as the information liaison between research and manufacturing facilities and developing, characterizing, and preparing new processes for insertion into production. • Developed metrology and process control strategies for all etch manufacturing processes related to 130, 110, 90 and 65-nm flash technology nodes. • Active member of multiple cross-module steering teams for new technology insertion, capital equipment selection and capacity modeling, advanced process control development and implementation, and sort and line yield improvement. Show less



AMD

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Manufacturing Engineer

  • Jun 1999 - Apr 2003

  • Completed one-year rotational engineering assignment, including individual sustaining and project engineer duties in the CMP, diffusion, implant, photolithography, and etch process modules. • Sustained the etch module in a continuous manufacturing environment. Assumed ownership of equipment and process issues that arose on shift, tracked and managed work in progress, monitored and sustained etch advanced process controllers, and leveraged rotational experience to solve inter-module manufacturing issues. • Etch technology transfer leader for 90-nm flash technology node. Assignment entailed acting as the information liaison between research and manufacturing facilities and developing, characterizing, and preparing new processes for insertion into production. • Performed tool startup on first dual damascene oxide etch chamber, including multi-layer process development and routine tool quality control implementation. • Contributed to the development of fab-wide copper protocol guidelines during the transition to copper as the back-end metal used in Flash devices. Show less