Experience

訊崴技術有限公司 XunweiTech

• Taiwan
• Telecommunications
• 1 - 100 Employee

• Foundry Product Manager

  • Apr 2019 - Present

  Support foundry process related engineer issue. Support foundry process related engineer issue.



濎通

• Foundry Product Manager

  • Aug 2018 - Mar 2019

  1.New product TO(TSMC）pilot run and bring up support. 2.Package BD & assembly ENG try run and MP handle. 3.Back-End project leader for new pilot to MP handle. (Coordination:CP/FT/SLT/ESD/OLT/CDM/Corner/HQA) 4.Corner CP/FT/SLT analysis and process window check and try to find out the better window. 5.Production products CP/FT monitor and low yield check and improvement. 6.Customer RMA root cause finding. 7.Package porting handle.(BD sim/Assembly try run and analysis.) 1.New product TO(TSMC）pilot run and bring up support. 2.Package BD & assembly ENG try run and MP handle. 3.Back-End project leader for new pilot to MP handle. (Coordination:CP/FT/SLT/ESD/OLT/CDM/Corner/HQA) 4.Corner CP/FT/SLT analysis and process window check and try to find out the better window. 5.Production products CP/FT monitor and low yield check and improvement. 6.Customer RMA root cause finding. 7.Package porting handle.(BD sim/Assembly try run and analysis.)



Icomm

• Australia
• Information Technology & Services
• 1 - 100 Employee

• Foundry Product Manager

  • Jun 2017 - May 2018

  1.New product TO(TSMC）pilot run and bring up support. 2.Package BD & assembly ENG try run and MP handle. 3.Back-End project leader for new pilot to MP handle. (Coordination:CP/FT/SLT/ESD/OLT/CDM/Corner/HQA) 4.Corner CP/FT/SLT analysis and process window check and try to find out the better window. 5.Production products CP/FT monitor and low yield check and improvement. 6.Customer RMA root cause finding. 7.Package porting handle.(BD sim/Assembly try run and analysis.) 1.New product TO(TSMC）pilot run and bring up support. 2.Package BD & assembly ENG try run and MP handle. 3.Back-End project leader for new pilot to MP handle. (Coordination:CP/FT/SLT/ESD/OLT/CDM/Corner/HQA) 4.Corner CP/FT/SLT analysis and process window check and try to find out the better window. 5.Production products CP/FT monitor and low yield check and improvement. 6.Customer RMA root cause finding. 7.Package porting handle.(BD sim/Assembly try run and analysis.)



聯發科

• Foundry Product Manager

  • Oct 2011 - May 2017

  1.New RF product TO(TSMC，HLMC）pilot run and bring up support. 2.Back-End project leader for new pilot to MP handle. (Coordination : DRC/CP/FT/SLT/ESD/OLT/CDM/Corner/HQA) 3.Corner CP/FT/SLT analysis and process window check and try to find out the better window. 4.Production products CP/FT monitor and low yield check and improvement. 5.Customer RMA root cause finding. 6.Support Qual data analysis for FAB porting/package porting/ECO. 1.New RF product TO(TSMC，HLMC）pilot run and bring up support. 2.Back-End project leader for new pilot to MP handle. (Coordination : DRC/CP/FT/SLT/ESD/OLT/CDM/Corner/HQA) 3.Corner CP/FT/SLT analysis and process window check and try to find out the better window. 4.Production products CP/FT monitor and low yield check and improvement. 5.Customer RMA root cause finding. 6.Support Qual data analysis for FAB porting/package porting/ECO.



Ralink

• Serbia
• Computers and Electronics Manufacturing
• 1 - 100 Employee

• Foundry Product Manager

  • Jul 2009 - Sep 2011

  1.CP yield monitor & yield improvement.. 2.CP low yield root cause finding & yield improvement. 3.RF product FT is more sensitivity and need more take care FT yield and yield stable improvement 4.FA/FIB support for product develop stage or customer RMA. 5.Support Qual data analysis for FAB porting/package porting/ECO. 1.CP yield monitor & yield improvement.. 2.CP low yield root cause finding & yield improvement. 3.RF product FT is more sensitivity and need more take care FT yield and yield stable improvement 4.FA/FIB support for product develop stage or customer RMA. 5.Support Qual data analysis for FAB porting/package porting/ECO.



聯華電子股份有限公司

• Fab Product Engineer

  • Jan 2005 - Jul 2009

  1.CP yield monitor & overkill analysis.2.Low yield root cause finding & yield improvement.3.FA anaylsis for low yield wafer.4.Support customer CP/FT overall issue.5.Support FAB baselne yield improvement.

• Process Integration Engineer

  • Jan 2002 - Jan 2005

  1.Process flow development & maintain.2.Process in line monitor.3.Low yield analysis & yield improvement.4.BKM process development.

• Testing Engineer

  • Mar 2000 - Jan 2002

  1.CP testing program development.2.Production CP testing program maintain.3.CP yield monitor and trouble shooting.