Overview

Multilayer board can be used in Communication Equipment, It is characterized by BGA, Line Width Line Spacing is Small, BGA is 4 pcs / pcs, Min.Line Width/Space is 3.5/3.5mil, Surface Treatment is ENIG 3U, Material is FR4,Tg150, Copper Thickness is 1oz. Multilayer board with three-dimensional space interconnection, the unit area of the wiring density and assembly density, to meet the smaller weight and space design requirements. Good News: Every orders will get free SMT Stencil , please check out our website at www.bentepcb.com/onlinepcb.html Tel: +86-755-8339 3378 Fax: +86-755-8342 2990 Email: service@bentepcb.com Website: www.bentegroup.com