JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control. Our application range includes: - HAST, HTS, TMCL stressed Cu, PdCu, Au, Ag wire packages - Silver wire packages (new) - Wafer Level Chip Scale Package (WLCSP) (new) - High Tg mold compound (new) - Film Over Wire (FOW) (new) - Chip on Board (new) - Electrical Overstress (EOS) failure sites - Surface contamination and corrosion - Wedge bonds exposure - 3D stacked-die IC package - Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices (new) - System in Package (SiP) (new) - Localized decapsulation (new) - Sensors with transparent mold compound (new) - Bond Over Active Circuit (BOAC) with exposed copper metallization (new) - Redistribution Layer (RDL) with PBO and copper metallization (new) Other applications under R&D
