Intech-Technologies is a leading provider of semiconductor prototyping services. We specialize in wafer dicing, wafer sort, and wafer back grinding, as well as assembly services such as wire bonding, die bonding, and flip chip bonding. We also offer package services, including package molding encapsulation, low profile quad flat package, and quad flat no lead package. Additionally, we provide failure analysis services such as SEM/X-ray, die shear, and wire pull. Our team of experts is dedicated to providing high-quality and efficient services to our clients. We understand the importance of timely delivery and accurate results, and we strive to meet and exceed our customers' expectations. We are committed to staying at the forefront of industry developments and use state-of-the-art equipment and techniques to ensure the best possible results for our clients. We are dedicated to building long-term relationships with our customers and are always ready to provide support and guidance throughout the entire process. Thank you for considering Intech-Technologies for your semiconductor prototyping needs. We look forward to connecting with you and discussing how we can help bring your projects to life.
