ABOUT US Heneng Technology is headquartered in Shenzhen, China with clients from all over the world, such as Europe, United States, UAE, Russia, Asia etc. We provide the most suitable service and solutions to clients from various fields, such as Robotics, Bio-medical, Automation, Telecommunication, Commercial Drones, Home Appliances, and more. SERVICE Our Turn-Key solutions include PCB Manufacturing, Electronic Components Procurement, PCB Assembly, Engineering Assistance(DFM&DFA), Cost-down Solutions, Box-Build, QA and Logistics Service. We have an experienced, talented and dedicated team with an extensive background in the fields of PCB Design & Manufacturing, Project Management, Supply Chain Management, etc. CAPABILITY Current products manufactured include backplane, hybrid boards, HDI boards, High TG boards, High Frequency boards, Halogen Free boards, Flex and Rigid Flex boards, Metal Substrate boards, IC Substrate boards and more. Production Capabilities Layers: Up to 42 Min Line width/spacing(mil) for inner layers: 3.0/3.0 Min Line width/spacing(mil) for outer layers: 4.0/4.0 Copper weight: 0.5 – 6.0 OZ Max Aspect Ratio: 11:1 Board thickness: 0.2mm-8.0mm Max Panel size: 18″ * 24″ Min Hole diameter(mil):4 Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc. Surface Treatment: HASL, ENlG, lmmersion Why Heneng? Many clients and businesses keep coming to Heneng Technology since they confidently know that our company provides the insight, knowledge, professional guidance and end-to-end services that helps them move forward with their goals. On top of these all, the company delivers pragmatic and professional solutions in order to provide fast and practical results. Our commitment to quality includes executive oversight in every engagement with unparalleled attentiveness to the relationship we forge with each of our clients.
