Overview

One of the most important problems that we are facing in the performance increase in electronic technology is “Cooling”. Making the electronic circuits more compact and squeezing them into very small volumes is a non-stop progress. However, the removal of the heat generated in such a small area, getting rid of this high heat flux, is one of the most important problems. Today's modern processor chips have exceeded 100W power consumption limits. Commercially available power transistors may have power dissipations in KW/cm² level. While these new high performance, cutting edge components are dreams of electronic designers, on the other hand, they are nightmares of mechanical and thermal designers. Because these magic components consume huge amount of power. In order to benefit from these state-of the-art components’ performance, it is required to remove this heat via the widest thermal highway. Especially in military applications, in most cases sealed structures are inevitable due to harsh environmental requirements. Generally, operating ambient temperatures are higher than commercial equipment. Also RFI/EMI shielding is another important concern. All these constraints make the cooling design much more complex, much more difficult. BNCool-APAK provides fast, cost-effective, efficient and reliable cooling solutions for challenging cooling requirements.