Experience

Kinetic Technologies
• United States
• Semiconductor Manufacturing
• 1 - 100 Employee
• Design Director

  • Oct 2022 - Present


Texas Instruments

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Analog Design Manager

  • Nov 2014 - Present

  Working on development of high voltage (40V application)/High power buck convertor for Automotive applications. Presently working on 7A, Multiphase buck convertor

• Member Group technical Staff

  • Sep 2013 - Present

  Worked on a pseudo fixed frequency hysteretic DCS buck convertor to handle 2.5A of average current. This core has a load transient response of +/-3% of vout for no load to full load step.

• Analog Design Manager

  • Aug 2016 - Jan 2023

• Principle Design Engineer
• Principle Design Enginner

  • Sep 2011 - Jul 2013

  After the take over of National Semiconductors by Texas instruments I am involved in the of the design and silicon debug of PMU with buck convertor. Recently I am working on device architecture/design of 25W buck controller, with external power FETs for SSD enterprise application.This application has 2 rails and both these needs to be combined into a single low voltage rail and deliver a max of 25W of power. We are filing a patent on this work. This device also has a backup boost convertor and a 10 bit ADC. Show less



National Semiconductor

• Semiconductor Manufacturing
• 400 - 500 Employee

• Principle Design Engineer

  • May 2009 - Sep 2011

  In this position I got involved in design and architecture of linear charger and switching chargers for handheld devices. This work resulted in couple of US patents:US20130043828A1: Battery Charger ArchitectureUS20130043829A1: Battery Charger with segmented power path switch.For this development of switching charger I had to work with teams across the world and co-ordinate with them so that all the blocks gets implemented as per spec.

• Staff Design Engineer

  • Sep 2006 - Sep 2010

  In 2006 I moved from Netherlands to Scotland to Join National semiconductors: In this position: 1. I am involved in the design of buck convertor, boost convertor, buck-boost convertor for mobile handset applications. Also was involved in top level integration of complex high pin count PMUs. 2. In all these devices I am involved from specification definition, tapeout, silicon debug and to release device for production During the device definition and silicon debug phase I get involved with customer interaction. 3. In development of PMU's and charger designs I had to work with designers spread all over the world and made sure that all the blocks are implemented as per spec. Show less



NXP

• Consumer Services
• 1 - 100 Employee

• Senior analog IC design Engineer

  • Oct 2005 - Sep 2006

  Worked in NXP semiconductor as senior Design engineer in Nijmegen, The Netherlands. In this position I have worked on design of Bandgap circuits, LDO's for mobile handheld devices. Worked in NXP semiconductor as senior Design engineer in Nijmegen, The Netherlands. In this position I have worked on design of Bandgap circuits, LDO's for mobile handheld devices.



texas instruments

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Design engineer

  • 2002 - 2005

  In this position I have worked in Texas Instruments, India and Dallas branches. During this period I was involved in design, testing and debuging of a complex power management chip containing Battery Charger, Crystal Oscillator, WCDMA, GSM, audio core ,LDO's and buck/boost converters. In this position I have worked in Texas Instruments, India and Dallas branches. During this period I was involved in design, testing and debuging of a complex power management chip containing Battery Charger, Crystal Oscillator, WCDMA, GSM, audio core ,LDO's and buck/boost converters.



Karnataka Micro Electronics, Manipal, India

• Member technical Staff

  • Nov 2000 - 2002

  I joined here immidiately after my education and went through a 1 year training which involved study of analog design, cmos process, Layout and algebriac design. During this period we designed a testchip and sent for fabrication and tested it. I joined here immidiately after my education and went through a 1 year training which involved study of analog design, cmos process, Layout and algebriac design. During this period we designed a testchip and sent for fabrication and tested it.


Karmic
• United States
• Wellness and Fitness Services
• Member technical staff

  • 2000 - 2002