Bill Fleck

Vice President Worldwide Automotive Solutions at Innovusion
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Location
Portland, Oregon, United States, US

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5.0

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Ian Hubbard

Bill has balanced the needs of a multi customer business portfolio to deliver class leading digital media content management solutions. Great customer focused guy to work with.

Bob Pinteric

Bill is very good at evangelizing new technologies in new markets and is very well connected. He takes a consultative approach with his customers and is a strong customer champion. Bill is very diligent in all of his efforts, including business development, product planning and sales.

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Experience

    • United States
    • Appliances, Electrical, and Electronics Manufacturing
    • 1 - 100 Employee
    • Vice President Worldwide Automotive Solutions
      • Mar 2022 - Present

      Manage global automotive engagements for Innovusion's exceptional LiDAR solutions. Manage global automotive engagements for Innovusion's exceptional LiDAR solutions.

    • United Kingdom
    • Writing and Editing
    • 1 - 100 Employee
    • Vice President of Automotive, Americas
      • Apr 2005 - Present

      Managed direct sales to all North American automotive OEMS and Tier Ones. Coordinated cross-regional automotive engagements in Europe, Japan, Korea, India and China with our sales, technical support, and marketing teams to help achieve deployment of Gracenote solutions in over 250 million vehicles, making Gracenote the #1 supplier of metadata solutions in the automotive market. Managed direct sales to all North American automotive OEMS and Tier Ones. Coordinated cross-regional automotive engagements in Europe, Japan, Korea, India and China with our sales, technical support, and marketing teams to help achieve deployment of Gracenote solutions in over 250 million vehicles, making Gracenote the #1 supplier of metadata solutions in the automotive market.

    • Business Development Manager for Telematics/Driver Information Systems
      • Jan 1998 - Mar 2005

      Developed the requirements and managed the introduction of the successful MPC5200 PowerPC processor into the automotive telematics and consumer markets. Quickly secured strategic cross-market wins in North America, Europe, and Asia. Market lead on the “transumer” team responsible for defining system and chip-level product strategy to bridge the automotive and consumer market segments. Developed the requirements and managed the introduction of the successful MPC5200 PowerPC processor into the automotive telematics and consumer markets. Quickly secured strategic cross-market wins in North America, Europe, and Asia. Market lead on the “transumer” team responsible for defining system and chip-level product strategy to bridge the automotive and consumer market segments.

    • Senior Account Manager
      • Jan 1995 - Jan 1997

      Sales of IC and ASIC design tools. Sales of IC and ASIC design tools.

    • Canada
    • Software Development
    • 1 - 100 Employee
    • Senior Account Manager
      • Jan 1990 - Jan 1994

      Sales of CAE software, custom IC development tools and computer platforms. Sales of CAE software, custom IC development tools and computer platforms.

    • Product Marketing Manager
      • Jan 1979 - Jan 1990

      Managed multiple product engineers responsible for HP’s microprocessor emulators, debuggers, simulators, and CASE products.

    • Lead Product Marketing Engineer
      • Jan 1986 - Jan 1987

      Responsible for HP’s line of embedded processor emulators and related third-party relationships. Pioneered next-generation, PC-based 32-bit processor emulation support.

    • Sales Representative/Systems Engineer
      • Jan 1979 - Jan 1986

      Sales of the aforementioned products, in addition to HP's electronic instrumentation product line. Additionally served as area sales and technical expert on HP's logic and communication/protocol analysis products.

Education

  • UC San Diego
    Bachelors, Electrical Engineering

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