Experience

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    • Jul 2019 - Present
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    • Jul 2019 - Jul 2019

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    • Jul 2019 - Jul 2019

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  Westinghouse Electric Company

  • Westinghouse Electric

    • Feb 2010 - Jul 2019

    Retired

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  Ericsson

  • Product Engineer

    • Jan 2005 - Feb 2009

    This covers Ericsson/Marconi/Fore Systems: Product Engineer on extremely complex, high speed, controlled impedance telecommunicationss printed circuit boards. Worked closely with design engineers and CAD design engineers on some of the most complex boards in the Telecommunications industry including a backplane which was 23 X 48 x 0.400 thick and 54 layers and cards which were 12 x 18 36 layers, one with over 13,000 surface mount components.Worked with large board fabrication houses to improve their capabilities to fabricate these boards and worked with large contract manufacturers to improve processes to assemble these boards.Established the process and coordianted the effort to make Ericsson products EU RoHS and China RoHS compliant.Worked with Ericsson Stockholm on broad band access products (FTTX) ducts, blown fiber, etc.

  • Product Engineer

    • 1999 - 2005

    See Ericsson

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  FORE Systems

  • Product Engineer

    • Jul 1997 - Jan 2000

    See Ericsson

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  Westinghouse Electric Company

  • United States
  • Nuclear Electric Power Generation
  • 700 & Above Employee

  • Senior Process Engineer

    • Jan 1993 - Jul 1997

    Responsible for coordinating all new product introductions both nuclear and commericial to the manufacturing floor. Within one three year period introduced over forty new printed circuti board designs, both thru-hole and surface mount, and set up the surface mount manufacturing systems to support this effort. My involvement in setting up these systems included justifying, specifying, purchasing, laying out, and start up with a final goal of producing high-mix, low volume products. I worked closely with design engineers and CAD designeers to ensure that new product developments met the manufacturing desgn requirements for in-house assembly equipment and coordinated the desgn efforts of subcontractors to convert high volume thru-hole boards to surface mount.

  • Senior JIT/Process Engineer

    • Jan 1985 - Dec 1992

    Responsible for all process improvements related to the assembly of printed circuit boards. Coordinated the activities in the automatic insertion areas utilizing Uninversal thru-hole equipment and also help to replace environnmently harmful CFC cleaning with No-clean technology. Team leader in setting up a Just-in-Time data base and with my experience gained at Mitsubishi Electric Nagoya Works implemented a Kanban system which covered not only products but also components.Also traveled to, and provided assembly training for Westinghouse products in India, Barbadoes, and Puerto Rico

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  Mitsubishi Electric

  • Westinghouse/Mitsubishi Electric Exchange Engineer

    • Jan 1984 - Dec 1984

    As a representative of Westinghouse, I immersed myself in the culture of Japan and for 1 year shared manufacturing knowledge between Mitsubishi and Westinghouse. In preparation for this one year assignment, I was required to take an intensive three month course with three Tutors (8 hours/day 5da...

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  Westinghouse Electric Company

  • Manufacturing Engineer

    • Mar 1973 - Dec 1983

    Responsible for process improvments in printed circuit board manufacturing. Also acted as the contact for all all products being subcontracted from other Westinghouse facilities. In 1983 all products manufactured in Detroit were migrated to Pittsburgh and I helped to set up the manufacturing of...

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  US Navy

  • Radioman 1st Class

    • Oct 1966 - Jan 1971

    Radioman 1st Class Communications Controller stationed in the Western Pacific during the Viet Nam conflict